Sensors for biomedicine presented at the 25th Innovation Day of the BMWi


Our exhibition at the Innovation Day of the German Federal Ministry of Economics and Technology (BMWi) for SMEs on 7 June 2018 in Berlin generated good feedback and a great deal of interest.

Our research institute presented the INNO-KOM project "Wafer Level Packaged Pressure Sensor With Through Silicon Vias" for the first time at this exhibition and communication platform with its own booth. It shows WLP (Wafer-Level-Packaging)-based piezoresistive bulk micromechanical pressure sensors using silicon direct bond connections and vias with increased chemical resistance as well as improved contact and long-term stability. Examples from the field of biomedical development and production for in vivo vital parameter measurement as well as sensors for optical blood pressure measurement and for installation in biomedical devices for feedback systems for blood sugar stabilization were also clearly demonstrated.