Direct laser imagesetter
|Duration:||1st March 2016 - 31st December 2016|
|Description:||The DWL66+ maskless laser direct-write lithography system enables flexible and comparatively fast direct exposures with a large, variable focus range for "first pass" designs of 3D MEMS and MOEMS.
Exposures over edges and large steps are only possible with conventional projection exposure methods by multiple exposures with different masks adapted for the corresponding focus planes. A direct writing method with focus tracking allows maximum imaging accuracy at each writing position. The depth and shape of structures thus no longer limit the imaging quality.
In combination with the spray coating system developed at CiS, a flexible, end-to-end 3D photolithography technology with outstanding imaging quality can be provided for the development of 3D MEMS and MOEMS.
|Project sponsor:||EuroNorm GmbH|
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