Current developments in hybrid and wafer level assembly
Which technology meets the technical requirements and offers competitive manufacturing costs for demanding applications? Which new possibilities and combinations arise and what are the future technological interfaces?
During the workshop, leading representatives from industry and research in microsystem and semiconductor technology will report on experiences and new developments in the field of packaging technology.
The focus will be on microsystems based on silicon sensors, ranging from innovative hybrid technologies to heterogeneous integration of complex systems at wafer level. Potential and limits of critical manufacturing steps or entire process chains with regard to efficiency, miniaturization, reliability as well as performance of the sensor systems will be highlighted and discussed.
Innovative joining technologies for flip-chip assembly, die bonding and hermetic sealing of assemblies at different integration levels will be presented, as well as the associated interfaces and pre-processes, which are increasingly being implemented at wafer level.
The event will provide an opportunity to learn about new possibilities, discuss technological interfaces and network the players.
The workshop will take place as a hybrid event on 12th September 2023 at the CiS Research Institute in Erfurt. The organizer is CiS e.V.
Workshop language is German.
