Current developments in hybrid and wafer level assembly
Which technology meets the technical requirements and offers competitive manufacturing costs? Which new possibilities and combinations have proven themselves?
During the workshop, leading representatives from industry and research in microsystem and semiconductor technology will report on experiences and new developments in the field of assembly & packaging. The focus will be on the reliable and low-feedback, voltage-optimized assembly of thin silicon sensors as well as high-performance optical assemblies, advantages of individual processes will be considered and discourse will be stimulated.
The event offers space to learn about new possibilities and to network among stakeholders.
The workshop will take place as a hybrid event on 12th September 2023 at the CiS Research Institute in Erfurt. The organizer is CiS e.V.
Workshop language is German.
