The CiS Analytic Competence Center (CAK)…
… offers a unique combination of the latest technology and highly qualified personnel.
… allows complex metrological investigations and special material and surface analyses.
… has a high-resolution 3-dimensional secondary ion mass spectrometry system (SIMS analysis cluster), the only one of its kind within a radius of several hundred kilometers and one of the most modern worldwide.
All phases of development from wafer level through the fabrication steps of Micro-Electro-Mechanical Systems (MEMS) and Micro-Opto-Electro-Mechanical Systems (MOEMS) as well as the qualification of the finished devices are accompanied by the CAK.
Control and characterization of layers, structures, surfaces, solids and mixtures of materials verify technologies to develop high-performance sensors for specific applications and their environmental conditions. Extensive optical, capacitive, electrical and mechanical tests as well as ultrasonic investigations represent the comprehensive spectrum of investigation methods. Stress tests address application-specific environmental scenarios, failure analysis and material investigations optimize reliability and long-term stability of electronic components.
Our core competencies here are:
- Measurement technology at wafer level (optical, capacitive, electrical and mechanical measurement methods as well as ultrasonic investigations)
- Analytics (preparation technology, defect and microstructures, layer and surface analyses, chemical composition)
- Reliability of sensors (standard load tests and test development)
