We develop along the entire value chain
More than 100 qualified scientific employees at the CiS Research Institute conduct application-oriented research and development on behalf of industry as well as in the context of public funded projects up to small series production. For our clients, we develop high-precision and long-term stable components for silicon-based sensor systems along the entire value chain. Individual competencies and technologies are bundled in our specialist areas (MEMS, MOEMS, Simulation & Design, Process Development, Wafer Processing, Packaging, Measurement & Analytics).
1. Simulation & Design
Highly specific design workstations are available for the design of customer-specific sensors, the development of design rules as well as layouts for mask production. Software tools are used to simulate the sensory properties and technological substeps.
2. Process Development
Based on high-tech competencies within wafer and component manufacturing, new processes and technology modules are developed that can later be integrated into the technology flow of research projects and product developments.
3. Wafer Processing
We have typical processes for monolithic integration of sensory and electronic functions in silicon wafers and chips, microstructuring processes, and technology platforms for double-sided and three-dimensional structuring.
All technological substeps of microassembly and housing of microelectronic and photonic components as well as microsystem sensor modules for prototypes and small and medium series are available.
5. Measurement & Analytics
Our CAK (CiS Analytics Competence Center) stands for the unique combination of the latest technology and highly qualified personnel for complex metrological investigations as well as special material and surface analyses.
6. Prototyping & Small Batches
Building on basic research as well as own developments via applied R&D services up to pilot production and small series production of MST components and microsystems, technology transfer is also realized.