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Workshop “Simulation and Design” successfully completed

27. September 2023/in Events, Simulation & Design

At the end of our 3-part hybrid workshop series, the topic of “Modelling in Microsystems Technology” was intensively examined on 26th September 2023. Representatives from science and industry discussed methods, software and the use of artificial intelligence for the simulation and design of silicon MEMS and MOEMS

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https://www.cismst.de/wp-content/uploads/news-2023-09-27-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-27 13:47:002023-09-29 09:50:04Workshop “Simulation and Design” successfully completed

CiS Workshop on Modelling in Microsystems Engineering

18. September 2023/in Events, Simulation & Design

Next week, on 26th September 2023, the CiS workshop “Modelling in Microsystems Engineering” will take place in Erfurt as a hybrid event. In microsystems technology, reliable simulation tools are a prerequisite for supporting the design of components and systems. The workshop will discuss mechanical and optical simulations as well as multidomain modelling, with a focus on silicon MEMS and MOEMS

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https://www.cismst.de/wp-content/uploads/news-2023-09-18-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-18 14:29:192023-09-18 14:29:36CiS Workshop on Modelling in Microsystems Engineering

Successful workshop on assembly and connection technology

13. September 2023/in Events, Packaging

At the workshop “Current developments in hybrid and wafer-level assembly” on 12th September 2023 in Erfurt, experts from mechanical and plant engineering, semiconductor foundries, scientists and AVT experts discussed individual processes in packaging and interconnection technology, their technical status and future potential with a focus on silicon-based microsystems. All participants agreed: the workshop offered numerous, exciting contributions as well as opportunities for exchange, networking and idea generation

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https://www.cismst.de/wp-content/uploads/news-2023-09-13-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-13 16:22:002023-09-18 14:26:27Successful workshop on assembly and connection technology

Silicon Science Award 2023 presented to Lukas Leon Barthelmann

5. September 2023/in CiS general, Events

A total of five outstanding works by young researchers were honored yesterday with the Silicon Science Award. The award ceremony took place on 4th September 2023, as part of the opening event of the international 60th Ilmenau Scientific Colloquium “Engineering for a Changing World” in the Audimax of the Ilmenau University of Technology

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https://www.cismst.de/wp-content/uploads/news-2023-09-05-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-05 15:35:062023-09-06 08:36:42Silicon Science Award 2023 presented to Lukas Leon Barthelmann

Current developments in hybrid and wafer-level assembly

4. September 2023/in Events, Packaging

The CiS Workshop with focus on packaging and interconnect technology will take place on 12th September 2023 in Erfurt under the motto “Current developments in hybrid and wafer-level assembly”. Look forward to exciting contributions as well as ample opportunity for professional exchange and networking

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https://www.cismst.de/wp-content/uploads/news-2023-09-04-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-09-04 15:27:002023-09-06 08:30:52Current developments in hybrid and wafer-level assembly

Improvement of the stability of hybrid silicon strain sensors (SiDMeses)

31. August 2023/in MEMS, Packaging, Pressure

In the SiDMeses research project, the long-term stability of hybrid silicon strain sensors was significantly improved by a targeted and accelerated reduction of the mechanical assembly stress and a precise, extremely parallel and symmetrical structure was generated

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https://www.cismst.de/wp-content/uploads/news-2023-08-31-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-08-31 15:00:002023-09-06 08:25:56Improvement of the stability of hybrid silicon strain sensors (SiDMeses)

Project start Thermopiles with carbon nanotube absorbers

23. August 2023/in MOEMS

The new project “Thermopiles with carbon nanotube absorbers” investigates the integration of thin coatings of carbon nanotubes on thermopiles with the aim of enabling higher absorption at low cost

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https://www.cismst.de/wp-content/uploads/news-2023-08-23-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-08-23 07:01:002023-08-22 12:50:33Project start Thermopiles with carbon nanotube absorbers

Project start KoSenDi: Compact sensor unit for measuring magnetic fields using diamond fluorescence

16. August 2023/in MOEMS, Packaging

In the newly started project KoSenDi (Compact Sensor Unit for the Measurement of Magnetic Fields Using Diamond Fluorescence), scientists at the CiS Research Institute are working on the miniaturization of a magnetic field sensor based on sticksoff defects (NV centers) in diamond

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https://www.cismst.de/wp-content/uploads/news-2023-08-16-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-08-16 12:30:582023-08-22 12:35:57Project start KoSenDi: Compact sensor unit for measuring magnetic fields using diamond fluorescence

Project start NivLer: Retrofit kit for non-invasive pressure measurement

9. August 2023/in Measurement, MEMS, Pressure

The new research project NivLer at the CiS Research Institute addresses the development of a retrofit kit for non-invasive pressure measurement in process pipes in order to be able to non-destructively record and digitize various condition variables

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https://www.cismst.de/wp-content/uploads/news-2023-08-09-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-08-09 14:13:182023-08-11 14:17:22Project start NivLer: Retrofit kit for non-invasive pressure measurement

Project start DiaTip: Active diamond-based scanning probes for QUANTUM metrology and nanofabrication – development of hybrid assembly methods

2. August 2023/in MEMS, Quantum

The CiS Research Institute is partner of the started joint project “DiaTip”. Together with the partners, the efficient production of diamond tips as well as a suitable assembly process for the joining of two components “active microcantilever” and “diamond tip” shall be developed

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https://www.cismst.de/wp-content/uploads/news-2023-08-02-home.jpg 90 120 CiS https://www.cismst.de/wp-content/uploads/logo-trans.png CiS2023-08-02 13:55:002023-08-03 08:00:41Project start DiaTip: Active diamond-based scanning probes for QUANTUM metrology and nanofabrication – development of hybrid assembly methods
Page 1 of 36123›»
  • Workshop “Simulation and Design” successfully completed

    27. September 2023
  • CiS Workshop on Modelling in Microsystems Engineering

    18. September 2023
  • Successful workshop on assembly and connection technology

    13. September 2023
  • Silicon Science Award 2023 presented to Lukas Leon Barthelmann

    5. September 2023
  • Current developments in hybrid and wafer-level assembly

    4. September 2023

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