Registration for the 19th edition of the International Superconductive Electronics Conference (ISEC), which will take place from 15th to 19th June 2025 in Erfurt, Germany, has started! Secure your participation and benefit from the attractive early bird discount until 28th April 2025!
The “ZugKraftSensor” project developed a silicon-based technology platform for permanently monitoring belt tension up to a load of around 35 kN in drive technology systems. By monitoring the mechanical tension, maintenance intervals can be planned precisely, material fatigue can be detected at an early stage and unplanned downtimes can be avoided
Dr. Klaus Ettrich, Business Unit Manager at the CiS Research Institute, will open the series of presentations at the 4th Technology Day Applied Sensor Technology (TAS) in Coburg. He will report on silicon-based MEMS sensors for checking safety-relevant bolted connections, which are used in mechanical engineering, conveyor technology and wind turbines
The leading photonics exhibition in the ASEAN region will take place from 26th-28th February at Marina Bay Sands. At the special exhibition area Photonics + Europe presented by IVAM, EPIC and W3+ of IVAM, at booth C206, the CiS Research Institute will present an excerpt of its portfolio and Prof. Thomas Ortlepp will give a lecture on “Photonic Quantum Sensor Based on Diamond NV-Centers – Hybrid Integration and Performance Evaluation”
In the new research project NIVO2, a novel isothermal solution is to be investigated in order to minimize instabilities and errors in the functionality of thermopile sensors under harsh environmental conditions. In addition, a front side etching process for the production of thin membranes will be developed and integrated into the thermopile sensors
The International Superconductive Electronics Conference (ISEC) invites abstracts for its 19th edition, which will take place from 15th-19th June 2025 in Erfurt, Germany. Papers can be submitted until 16th February 2025
The new research project SAIn (Self-adjusting cryogenic Indium Interconnection) pursues the goal of a self-adjusting chip level package with an adjustment accuracy of ±1µm and better. It includes the development of the electroplating process for indium deposition to produce the indium contacts and the reflow process to remelt the deposited indium columns into indium bumps
The German Physical Society is offering various events and activities under the motto “Quantum2025 – 100 years are just the beginning…”. The official opening of the Quantum Year 2025 is taking place today in Berlin. The CiS Research Institute is also dedicated to this future topic in several joint projects and is researching special quantum sensors and heterogeneous assembly and integration processes for quantum computers
The aim of the recently launched PuSch research project is to use structurable, optically non-transparent coatings to cover reflective areas on the chip surface of photodiodes and arrays. This suppresses stray light when used in the measuring device and increases the useful portion of the detector signal. When developing the technology, particular attention must be paid to compatibility with downstream processes and operating conditions
Two important innovations from the CiS Research Institute were ceremoniously honored yesterday at the Ilmenau University of Technology. In the presence of representatives from business, science and politics, the scientists received the coveted iENA Inventor Medals for two pioneering developments that they presented at the 2024 International Trade Fair “Ideas – Inventions – Innovations” in Nuremberg
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