The MEMS department develops and investigates micro-electronic-mechanical components, sensors and systems. The focus here is on mechanical measurands such as pressure, force, volume flow, mass flow, rotation rate, roughness, displacement, torque, hardness, filling level. But chemical quantities are also measured if they are traceable to mechanical quantities, such as concentration. MEMS devices are made of silicon and process mechanical or electrical signals. MEMS devices are manufactured with semiconductor processes and can be found in many applications, e.g. in the smartphone when rotating the display. At the CiS Research Institute, we primarily target the use of the piezoresistive effect.
In close collaboration with the areas of Simulation & Design, Process Development, Wafer Processing, Packaging and Measurement & Analytics, we offer a closed value chain from the analysis of the measurement task to the prototype and small series.
Our main areas of expertise are, based on silicon:
- pressure sensors,
- strain gauges,
- cantilevers,
- interdigital electrode,
- and temperature diodes
MEMS Pressure Sensors
- Differential, absolute and relative pressure
- Customized sensor design
- High long term stability
- Higher operating temperature up to +300°C
Force & Displacement Sensors
- Si strain gauges with small sensor size
- Glass solder as innovative assembly and connection technology
- Silicon cantilever with integrated readout
Multi sensors
- Measurement of pressure, mass flow, temperature and concentration – in one chip
