The process development team deals with the introduction of new processes and technology modules. Based on the latest research results, technology complexes are developed which allow a transfer to a production-related process. The aim is to expand competencies within wafer and component manufacturing.
Currently, the work is focused on:
- the extended structuring possibilities of silicon with the aim of a significant increase in the sensitivity of the measurand to be read out of the MEMS device,
- the optimization and implementation of various wafer bonding processes into the process landscape of the CiS Research Institute,
- and the different metallization processes from classical sputtering technologies to electroplating and inkjet processes.
The latter serves, among other things, as an interface between the front-end wafer manufacturing and subsequent packaging technology. Component-friendly processes are the aim to preserve and even improve the sensitivity of the sensor chips in the process.
Characteristic for the process development is the feedback to employees in the area of simulation & design, since technological correlations on the design process of a sensor chip are the prerequisite for the successful implementation of the targeted layout. For us, process development always means a holistic technology concept that explores feasibilities and thus addresses current requirements.