We are your partner for industrial research and development of silicon-based sensors.
You benefit from our many years of experience in development and manufacturing. We offer a closed in house value chain from design to manufacturing.
Main areas of activity are MEMS and MOEMS with highest stability and reliability.
You will receive adapted customized solutions for your sensor systems, as well as small series manufacturing and reliability and lifetime qualification.
CiS Forschungsinstitut für Mikrosensorik GmbH is certified according to DIN EN ISO 9001:2015
News
Happy Easter – Creative Contest for Kids2. April 2026The Easter holidays with family and friends are just around the corner, and the management of the CiS Research Institute once again invited everyone to participate in a creative hands-on activity. The many creative submissions from the young artists can be viewed in our online gallery [Read more]
Machine Learning Electromigration Parameters (MEL)31. March 2026The current research project, Machine Learning Electromigration Parameters (MEL), aims to lay the groundwork for new software tools to characterize and optimize materials with regard to electromigration. This effect limits the service life and long-term stability of semiconductor devices in microsensor technology, power electronics, and integrated circuits. A better understanding of the physicochemical processes paves the way for new, improved developments [Read more]
Webinar Freeform 3D Structured Silicon Photodiodes27. March 2026Dr. Martin Schädel, Head of the MOEMS department at the CiS Research Institute, will discuss new opportunities arising from technologies for three-dimensional structuring of silicon in a webinar on Monday, 30th March 2026, at 15:00 [Read more]
Technology-focused startups receive funding through the getstarted2gether competition26. March 2026The 9th pitch event of the Thuringian competition getstarted2gether took place on 24th March 2026, at the Eiermannbau in Apolda. Ten technology-focused startups from Thuringia were awarded a total of one million euros in funding provided by the Thuringian Ministry of Economic Affairs [Read more]
Project Launch: Development of Innovative Layered MEMS-IR Emitters18. March 2026The new EiS research project focuses on the development of innovative stacked-layer MEMS-IR emitters. The goal is to create an even more miniaturized and cost-effective chip that offers at least the same light output as existing chips, thereby opening up new areas of application [Read more]
| Events |
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| 14.04.2026 - 16.04.2026: Sensor Shenzhen Shenzhen, China [+Cal] |
| 14.04.2026 - 18.04.2026: ICEP - International Conference on Electronics Packaging and Hybrid Bonding Symposium Hiroshima, Japan [+Cal] |
| 15.04.2026: 5. Symposium Elektronik und Systemintegration Landshut, Germany [+Cal] |
| 19.04.2026 - 26.04.2026: ICSM-ICQMT 2026 Fethiye-Ölüdeniz, Turkey [+Cal] |
| 20.04.2026 - 24.04.2026: Hannover Messe Hannover, Germany [+Cal] |
| [show all events] |
