Research and Development from Design to Prototyping

We are your partner for industrial research and development of silicon-based sensors.
You benefit from our many years of experience in development and manufacturing. We offer a closed in house value chain from design to manufacturing.

Main areas of activity are MEMS and MOEMS with highest stability and reliability.
You will receive adapted customized solutions for your sensor systems, as well as small series manufacturing and reliability and lifetime qualification.

CiS Forschungsinstitut für Mikrosensorik GmbH is certified according to DIN EN ISO 9001:2015

News

  • Silicon-based microsensors at SENSOR+TEST in Nuremberg
    From 9th-11th June 2026, the CiS Research Institute will once again be exhibiting at the international gathering for sensor, measurement, and testing technology in Nuremberg. At SENSOR+TEST 2026, interested visitors can meet our experts again this year at Booth 501 in Hall 1 to discuss the latest research findings in silicon-based microsensor technology. At the 23rd ITG/GMA Symposium “Sensors and Measurement Systems 2026,” the accompanying scientific conference at the Nuremberg Convention Center West (NCC West), the CiS Research Institute will be represented with four scientific presentations [Read more]
  • Launch of the Pash-Sense Project: Development of a Highly Sensitive Hydrogen Sensor Based on a Palladium-Silicon Schottky Diode
    To enable the early detection of hydrogen leaks at trace levels, the CiS Research Institute is developing a novel, highly sensitive sensor based on a Pd/Si Schottky diode with an integrated heating structure. To ensure the flawless manufacturing required for this component, the wafer inspection system - recently approved as part of the “TechWB” investment project - is being used for high-precision defect analysis in the submicrometer range [Read more]
  • Competitive German Quantum Computer (CoGeQ): Subproject involving the development of demonstrators successfully completed
    The final results of the research conducted as part of the “CoGeQ” project were presented at Quantum Photonics 2026 in Erfurt in early May. The collaborative project aimed to demonstrate a mobile spin-based quantum processor based on NV centers in diamond. The CiS Research Institute was responsible for the field of assembly and interconnection technology and developed an efficient method for assembling the layered stacks consisting of a diamond chip and a silicon interposer [Read more]
  • Launch of the aQuSiS Project: Acceptor-Based Quantum Systems in Silicon
    Color centers such as the G- or T-center in silicon are currently used as the building blocks for silicon-based quantum technology. The aQuSiS research project aims to realize indium-based acceptor defects as readily accessible quantum systems for the first time. The increased understanding of the structure and functioning of this elementary quantum building block could serve as the foundation for its continued integration into modern quantum technologies [Read more]
  • Project Completion NH3-BZ: Photoacoustic Sensor for Hydrogen Production
    The sensing cell is designed to determine the residual ammonia content in a dry N₂/H₂ gas mixture—a blend of nitrogen (N₂) and hydrogen (H₂) containing 75% hydrogen by volume—and is intended to enable real-time monitoring. The developed solution is based on innovative thermal emitters and operates without a chopper. Custom sensor elements can be quickly integrated [Read more]
Events
16.09.2026 - 18.09.2026:
Sensor China Expo & Conference
Shanghai, China [+Cal]
16.09.2026 - 18.09.2026:
Electronica India
Bengaluru, Indien [+Cal]
21.09.2026 - 24.09.2026:
ESREF 2026 - 37th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Vienna, Austria [+Cal]
23.09.2026 - 25.09.2026:
COMSOL Conference 2026
Cambridge, UK [+Cal]
27.09.2026 - 02.10.2026:
GADEST 2026
San Servolo, Italy [+Cal]
[show all events]