
Launch of the aQuSiS Project: Acceptor-Based Quantum Systems in Silicon
/in Measurement, QuantumColor centers such as the G- or T-center in silicon are currently used as the building blocks for silicon-based quantum technology. The aQuSiS research project aims to realize indium-based acceptor defects as readily accessible quantum systems for the first time. The increased understanding of the structure and functioning of this elementary quantum building block could serve as the foundation for its continued integration into modern quantum technologies
Project Completion NH3-BZ: Photoacoustic Sensor for Hydrogen Production
/in Hydrogen, MEMSThe sensing cell is designed to determine the residual ammonia content in a dry N₂/H₂ gas mixture—a blend of nitrogen (N₂) and hydrogen (H₂) containing 75% hydrogen by volume—and is intended to enable real-time monitoring. The developed solution is based on innovative thermal emitters and operates without a chopper. Custom sensor elements can be quickly integrated
CiS Research Institute Returns as an Exhibitor at Quantum Photonics
/in Events, Photonic, QuantumOn 5th and 6th May 2026, the CiS Research Institute will present its portfolio of quantum technologies at Booth 615 in Hall 2 at the Erfurt Trade Fair. Dr. Mario Bähr, a researcher at the CiS Research Institute, will speak on “Enabling Technologies for Quantum Applications” during a coffee pitch on Tuesday at 15:15
Technologies for the Future: CiS Research Institute at the 2026 Hannover Messe
/in Events, Medical technology, MEMS, MOEMS, PressureOver the next five days, our experts will be showcasing new project results and applications of silicon-based MEMS and MOEMS sensor concepts in Hall 13 at the LEG’s Thuringian joint booth (Booth E24) in Hanover
Plenary presentation at the 5th Symposium on Electronics and System Integration
/in Events, IR, MOEMSThe 5th Symposium on Electronics and System Integration at Landshut University of Applied Sciences will kick off on 15th April 2026, with three plenary presentations. In one of the presentations, Toni Schildhauer of the CiS Research Institute will discuss the topic “MEMS-IR Emitters: From Digital Twins to Novel Connection Techniques and Standardized Measurement Protocols.”
Happy Easter – Creative Contest for Kids
/in CiS generalThe Easter holidays with family and friends are just around the corner, and the management of the CiS Research Institute once again invited everyone to participate in a creative hands-on activity. The many creative submissions from the young artists can be viewed in our online gallery
Machine Learning Electromigration Parameters (MEL)
/in MeasurementThe current research project, Machine Learning Electromigration Parameters (MEL), aims to lay the groundwork for new software tools to characterize and optimize materials with regard to electromigration.
This effect limits the service life and long-term stability of semiconductor devices in microsensor technology, power electronics, and integrated circuits. A better understanding of the physicochemical processes paves the way for new, improved developments
Webinar Freeform 3D Structured Silicon Photodiodes
/in Events, MOEMSDr. Martin Schädel, Head of the MOEMS department at the CiS Research Institute, will discuss new opportunities arising from technologies for three-dimensional structuring of silicon in a webinar on Monday, 30th March 2026, at 15:00
Technology-focused startups receive funding through the getstarted2gether competition
/in EventsThe 9th pitch event of the Thuringian competition getstarted2gether took place on 24th March 2026, at the Eiermannbau in Apolda. Ten technology-focused startups from Thuringia were awarded a total of one million euros in funding provided by the Thuringian Ministry of Economic Affairs
Project Launch: Development of Innovative Layered MEMS-IR Emitters
/in IR, MOEMSThe new EiS research project focuses on the development of innovative stacked-layer MEMS-IR emitters. The goal is to create an even more miniaturized and cost-effective chip that offers at least the same light output as existing chips, thereby opening up new areas of application











