Over the next five days, our experts will be showcasing new project results and applications of silicon-based MEMS and MOEMS sensor concepts in Hall 13 at the LEG’s Thuringian joint booth (Booth E24) in Hanover
Silicon strain gauges (Si-SG) offer numerous outstanding properties. To reduce or compensate for the effects of temperature, temperature-sensing resistors, temperature diodes, and bipolar transistors were also integrated onto the same chip. The on-chip pnp transistors made it possible to implement temperature-compensated sensor configurations
ENFORCE TAC, Germany’s leading trade fair for security and defense, will kick off in Nuremberg on 23rd February 2026. The CiS Research Institute will be represented for the first time with a stand in Hall 6, Stand 6-215, the joint stand of LEG Thüringen, showcasing relevant development results such as a mobile vital sensor system, customer-specific photodiode modules for laser warning systems, a retrofit kit for non-invasive pressure measurement, and sensors for belt tension monitoring
From 17th-19th February 2026, the 21st “Trento” Workshop on Advanced Silicon Radiation Detectors will take place in Perugia, Italy. The CiS Research Institute will be represented there with a contribution on improving low gain avalanche detectors (LGAD) in terms of sensitivity to low-energy electrons
On 29th January 2026, around 40 students from the “Am Schwemmbach” cooperative comprehensive school in Erfurt visited the CiS Research Institute for Microsensor Technology to explore the world of scientific and technical professions
In the completed NivLer project, the CiS Research Institute developed a non-invasive retrofit solution for monitoring pipe systems in industry. The retrofittable sensor supports data-based maintenance optimization through early detection of wear and tear and is also suitable for use in areas with high hygiene requirements, such as pharmaceutical and food production
VACOM wins the Thuringian Innovation Award 2025 and sets new technological standards with its new miniaturized vacuum sensor CASSINI. The scientific and technological basis for the microelectromechanical system (MEMS) was laid in joint research projects with the CiS Research Institute
In the KTB project, various programs were combined into a complex simulation tool for the development of high-precision and long-term stable pressure sensors in order to simulate the characteristic curves of MEMS components, enabling a continuous simulation process
The new “ZEBA” research project is investigating image-property relationships and developing an AI-supported process flow that can be integrated into the manufacturing process and provides non-destructive information about the expected burst pressure of individual chips
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