For the determination of surface hardness in the nanometer range, a new measuring head combining a force and displacement sensor is being developed in the recently launched “NanoSense” project. It is to be connected modularly to common universal testing machines and XY-axis manipulators
MEMS-based piezoresistive force sensors can be used to monitor preload forces or contact forces. Our webinar will go into the technical basics of such sensors and we will show you some demonstrators of silicon strain gauges (Si strain gauges) developed by us
The aim of the newly launched ZIM cooperation project AmmoniaSense is to record the ammonia concentration with a stationary inline measuring system in order to optimally control biogas plants. The CiS Research Institute is developing the ammonia sensor system, which will be used in combination with a hydrogen sulphide sensor
The German government’s National Hydrogen Strategy is a building block for a successful climate change and secure energy supply. As a development partner for application-specific silicon sensors, the CiS Research Institute is dedicated to the topic of “green hydrogen” in research projects. Cooperation on current research topics, including hydrogen, is bundled at the regional level by the FTVT
Direct contact with the medium is difficult to implement for silicon-based microsensors. In order to fully exploit miniaturisation, corrosion protection is applied at chip level. This makes an application in more demanding environments possible even without additional protective constructions
At InnoCON Thuringia on 24th November 2020, Dr. Olaf Brodersen will explain the latest results of the growth core HIPs and the SiCer technologies to be developed therein for high performance sensor systems. The InnoCON starts as online event at 3:00 PM
Harsh environmental conditions require robust and stable pressure sensors. The new and further development of wafer-level packaging technologies increases performance, extends areas of application and reduces manufacturing costs. The result is patent pending
The participants of the CiS MEMS workshop on pressure sensor technology discussed online the development of sensor elements, their assembly, test methods and applications. Innovative AVT, in particular wafer bonding processes, were a focal point this time
Simultaneous measurement of differential pressure and process pressure – The approach pursued by CiS uses miniaturised pressure sensors which can be applied to carrier materials such as silicon or ceramics by means of flip-chip technologies. By means of adapted passivation processes (ALD, Parylene, etc.), the pressure sensors are available in a media-resistant design
Thuringia’s industrial companies and research institutes are working together in the HIPS growth core to develop new high-performance sensors based on the already patented SiCer technology and to market them jointly in the future. SiCer technology stands for a unique combination of silicon technology (Si) with ceramic multilayer technology (Cer)
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Tel.: +49 361 663 1410
E-Mail: info@cismst.de
