Sensitive washer detects clamping force of bolted joints
For the measurement of clamping forces in safety-relevant bolted joints, the CiS Research Institute developed a sensitive washer including a measuring method for detecting and testing
Novel gravity sensors for high-precision exploration of the Earth’s surface geology [video]
/in MEMS, Quantum, Waferprocessing /by CiSAs part of the M-Gravi project, the CiS Research Institute is developing novel gravity sensors for high-precision exploration of the geological features of the Earth’s surface. The sensors consist of four individual silicon wafers and use a wafer-level stacking technology
Second online webinar successful – Further topics planned [video]
/in Events, Force, MEMS, Packaging /by CiSOur second online webinar on the topic of “Silicon-based Piezoresistive Force Sensors” on 20.04.2021 was a complete success. The speakers Dr. Klaus Ettrich, Business Unit Manager MEMS, Dr. Thomas Frank, Department Manager MEMS, and André Grün, Development Engineer Packaging Technology, presented MEMS-based piezoresistive force sensors for monitoring preload forces or contact forces
Trade Fair Sensor+Test and Congress SMSI
/in Events, Force, MEMS, MOEMS, Pressure /by CiSNext week, the SENSOR+TEST 2021 trade fair and the accompanying international congress SMSI 2021 will start. Both events will take place online and the CiS Research Institute will be represented with a digital presence and a presentation. Get your free online ticket
Photoacoustic sensors based on wafer-level packaging
/in MEMS, Waferprocessing /by CiSPhotoacoustic sensors measure carbon dioxide and nitrogen oxides with high sensitivity. Increasingly, other gases such as methane, ammonia, ethylene or gas leaks in pipelines are being detected. In the PAS project, the CiS Research Institute is starting the development of an integrated photoacoustic gas sensor based on NDIR sensors
Exhibition booth at HM21 Digital Edition
/in Events, Force, MEMS, MOEMS, Pressure, UV /by CiSThis week at HM21 Digital Edition, we present current research topics and project results in the development of silicon-based MEMS and MOEMS sensor concepts
First Status Workshop of the BMBF Growth Core HIPS
/in Events, MEMS, Packaging, Waferprocessing /by CiSThe 1st status workshop of the BMBF growth core HIPS will take place on April 7, 2021 as a free online event. Organized by the host TU Ilmenau, guests and interested parties are welcome from 9:00 to 16:30. The CiS Research Institute is involved in two projects to develop an innovative multi-sensor platform for capturing sensor information in challenging environments
H2MEMS – Novel hydrogen sensor with highest sensitivity and selectivity based on silicon-based MEMS sensor structures
/in Energy, MEMS, Pressure /by CiSAs a specialist in the development of silicon-based pressure sensors, the CiS Research Institute is developing and testing palladium-coated MEMS structures with its partners in the H2MEMS project. The volume expansion of palladium during hydrogen deposition is being tested as a measuring principle
NanoSense – Development of a hardness measuring head based on a novel combined force-displacement sensor
/in Force, MEMS /by CiSFor the determination of surface hardness in the nanometer range, a new measuring head combining a force and displacement sensor is being developed in the recently launched “NanoSense” project. It is to be connected modularly to common universal testing machines and XY-axis manipulators
Webinar with Live Demo: Silicon-based Piezoresistive Force Sensors
/in Events, Force, MEMS, Packaging /by CiSMEMS-based piezoresistive force sensors can be used to monitor preload forces or contact forces. Our webinar will go into the technical basics of such sensors and we will show you some demonstrators of silicon strain gauges (Si strain gauges) developed by us