At the 2nd HIPS “Silicon meets Ceramics” status workshop, the alliance partners will provide an overview of the current status of their R&D work. Tomorrow’s online event will focus on high-performance sensor technology, multilayer ceramic technology and silicon-based packaging technology
Resonant pressure sensors have versatile potential for applications in the hydrogen economy. The newly launched research project ReSi-DDS of the CiS Research Institute aims at the development of stacking technologies for the fabrication of resonator structures for resonant silicon pressure sensors
We will present current research results in several papers at the MikroSystemTechnik Kongress from November 8 to 10, 2021. Topics will include mechanical and optical silicon-based components, packaging as well as practical applications in business and quantum technologies
The speakers Dr. Klaus Ettrich, Sebastian Pobering and Michael Blech held a webinar on October 21 on the topic of “Piezoresistive silicon pressure sensors for higher operating temperatures up to approx. 300°C”. In the webinar, which lasted about 45 minutes, there was an introduction to the structure and essential properties of this type of sensor, and in the second part, solutions for extending the operating temperature range up to approx. 300°C were presented
The IMAPS Autumn Conference meets in Munich from 21-22.10.21. The CiS Research Institute reports on innovative joining technologies in the lecture and shows new results of SiCer technology research with the growth core HIPS in the accompanying exhibition
At the Windmesse Symposium in Hamburg, visitors will learn more about technical innovations, economic aspects and the market development of on- and offshore wind energy. In his bolt sensor lecture on October 5, 2021, Arndt Steinke will provide information on “Innovative preload force sensors for bolted connections”
The newly designed piezoresistive pressure sensor chips with analog integrated temperature compensation are suitable for operating temperatures of up to about 300°C. The sensor is based on an intelligent connection of the measuring bridge with passive components. The basis is an intelligent interconnection of the measuring bridge with passive components
Based on a MEMS technology platform, a sensor module was developed that determines the preload force and the operating force as well as their change over time. The user can flexibly design a measurement cycle, thus achieving greater maintenance intervals as well as the possibility of remote diagnostics
As a result of advancing automation and autonomously operating machines and systems, low-cost force sensors that can be integrated into the systems are required. Preliminary tests show that silicon strain gauges joined to stainless steel with glass solder can be expected to give good results
Start for the preliminary research project “High-End Acceleration Sensors”(HEB) – The project aims at the development of a CMOS-compatible manufacturing process for high-resolution capacitive MEMS acceleration sensors with a resolution of 0.001⁰ for cost-efficient application as tilt sensor
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