With the topics “MEMS Sensors in Transition: New Approaches to Precision and Integration” and “NDIR Sensors: From Components to Systems,” the CiS workshops once again provided valuable insights and sparked exciting discussions this year. Many thanks to all the speakers and participating guests
The first Thuringian Aerospace Day took place on 1st October 2026, at the ad hoc Arena in the Ernst-Abbe-Sportfeld in Jena. The joint event, organized by the Thuringian Ministry of Economic Affairs, LEG Thüringen, and the Saxony/Thuringia Competence Center for Aerospace Technology (LRT), brought together numerous stakeholders from business, academia, and politics. The CiS Research Institute was also present as an exhibitor
The international ESREF conference in Vienna focuses on the reliability and failure analysis of components in microelectronics, nanoelectronics, and optoelectronics. On September 24, 2026, Julia Baldauf, a researcher at the CiS Research Institute, will present the results of the DotIR research project. Appropriate doping in MoSi2 is intended to reduce electromigration effects and increase the service life
From 16th to 18th September 2026, international experts gathered at Sensor China in Shanghai to foster dialogue and cooperation between European and Chinese players in the sensor and IoT industries. The CiS Research Institute was represented at this annual event with a conference presentation and an exhibition booth
With electronica India in Bengaluru, South Asia’s leading trade fair for electronic components, systems, applications, and solutions opens its doors. The CiS Research Institute will make its trade show debut in India from September 16 to 18, 2026, in Hall 5 of the Bangalore International Exhibition Centre (BIEC) at the International Pavilion of Messe München
In the new oLGAD research project, we are investigating layer systems designed to improve the performance of detectors by reducing dark current and increasing sensitivity for the detection of low-energy electrons
The HIVOS research project investigated the interaction of various pre-structured adhesive layers in combination with high-precision joining technologies and automated assembly processes for the hybrid assembly of complex optoelectronic microsystems. Newly developed automation solutions now enable the fully automated assembly of modules at the wafer or panel level, thereby significantly reducing process times
The OSCAR collaborative project is developing a novel high-pressure optical sensor system for inline monitoring of technical fluids under real-world process conditions. The goal is to integrate a high-pressure-resistant optical cell with modular optomechanical components and integrated electronics/firmware into a compact screw-in solution. This enables reproducible measurements directly at the process – with high resistance to pressure, temperature, and media – without requiring additional installation effort
In the KoSenDi research project, specific optical detectors were developed that achieve performance improvements and cost advantages through high application specificity. A partially transparent photodiode can measure the intensity of the excitation light directly in the optical path, and for fluorescence analysis, thin-film filter technology was integrated into a photodiode to suppress the excitation light
The new ReSpektIS research project focuses on the development of a novel, compact optical component for a measurement system designed to perform highly accurate relative measurements of the refractive index of gaseous media, or a refractometer based on an integrating sphere for highly sensitive refractive index measurements of gaseous media
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