The newly launched NO-TICE research project at the CiS Research Institute involves investigating ways of compensating for the influence of temperature, particularly on the zero point of the raw signal in sensors with very low transverse strain sensitivity, in order to minimize the amount of calibration required and thus conserve resources in terms of costs, time, and materials
The “ZugKraftSensor” project developed a silicon-based technology platform for permanently monitoring belt tension up to a load of around 35 kN in drive technology systems. By monitoring the mechanical tension, maintenance intervals can be planned precisely, material fatigue can be detected at an early stage and unplanned downtimes can be avoided
Dr. Klaus Ettrich, Business Unit Manager at the CiS Research Institute, will open the series of presentations at the 4th Technology Day Applied Sensor Technology (TAS) in Coburg. He will report on silicon-based MEMS sensors for checking safety-relevant bolted connections, which are used in mechanical engineering, conveyor technology and wind turbines
As part of the ZIM cooperation project NanoSense, the CiS Forschungsinstitut, together with two other partners, developed a measuring head for hardness measurement for integration into universal testing machines and xy manipulators, in which the measuring distance and measuring force are in line with each other
From 13th to 16th November 2023, the COMPAMED, the world’s leading trade fair for the medical technology supply sector, will open its doors in Düsseldorf and we will be presenting applications of silicon-based sensor technology in medical technology at our booth H23-4 in hall 8A within the joint stand of the IVAM trade association.
As part of the COMPAMED HIGH-TECH Forum by IVAM, Dr. Martin Schädel, Business Unit Manager MOEMS, will present selected research and development results on the topic of “Silicon-based microsensors for medical and life science applications” on 13th November
Under the abbreviated name Nanolever, a project recently started at the CiS Research Institute with the aim of producing a sensor for determining layer stress. A number of measurement methods use the layer stress as a physical principle. Here, the deformation of a bending beam due to the stress differences of a bimorph is technically exploited
“Microtechnologies for a smart world” is the slogan of this year’s IVAM Hightech Summit in Bochum on 3rd & 4th May 2023. Prof. Thomas Ortlepp will moderate the session “Smart Mobility” and open the discussion with the presentation “MEMS Development for Smart Mobility – Driver Condition Monitoring for Safety”
The newly launched research project “Stress-independent on-chip temperature sensing for silicon strain gauges (SOT)” aims at developing a temperature sensing of piezoresistive transducers optimized with respect to mechanical stress. This is to be achieved by using on-chip integrated bipolar structures
The new R&D project miniOffset focuses on the development of a silicon-based piezoresistive technology platform with minimal bridge base detuning. The basis is formed by CMOS/MEMS-compatible materials combined with cost-effective manufacturing processes
The 11th EASS conference will be held in Erfurt on July 5 and 6 and will focus on the resource-saving development of energy-autonomous sensor systems (EASS) and their networking. The CiS Research Institute participates with a presentation and a poster and offers an on-site visit for conference participants
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