For the second time, the CiS Research Institute will be presenting the latest research findings on silicon-based sensor technology at Semicon Europe in Munich. Our experts will be available for in-depth discussions at the joint booth of the Thuringia State Development Corporation in Hall B1, Booth 317, from 10th-13th November. We look forward to your visit and a stimulating exchange of ideas
In the recently completed miniOffset research project, a new scalable technology platform was used to minimize sensor performance – particularly zero offset and its temperature dependence – at the wafer and chip levels. Cost-effective CMOS/MEMS-compatible materials and processes can be used for this purpose
On 20th June 2026, the CiS Research Institute invited visitors to explore, participate, and marvel at interactive experiments and demonstrations as part of Ilmenau’s Science Night. Visitors of all ages were able to immerse themselves in the fascinating world of research and technology. We presented a diverse range of our silicon-based microsensors for visitors to learn about and try out
The successfully completed ZIM collaboration project ApproxiSens resulted in the development of a novel measurement system for hardness testers that raises industrial hardness measurement to a new level of quality. The newly developed measurement system for industrial hardness testing increases throughput in batch measurements by using precise control to achieve high speeds as the indenter approaches the test surface
COMPAMED, a leading international trade fair for medical suppliers, begins today in Düsseldorf. The CiS Research Institute will be represented at the IVAM joint booth in Hall 8a, Booth F35-2. Until Thursday, 20th November 2025, experts in the medical supply sector will come together to present components for medical devices and equipment and discuss high-tech solutions
On 12th and 13th November 2025, the 24th Precision Fair will take place at the Brabanthallen in ‘s-Hertogenbosch. The CiS Research Institute for Microsensor Technology will be exhibiting for the first time at the joint stand of LEG -Thüringen in hall 6, booth202
The newly launched NO-TICE research project at the CiS Research Institute involves investigating ways of compensating for the influence of temperature, particularly on the zero point of the raw signal in sensors with very low transverse strain sensitivity, in order to minimize the amount of calibration required and thus conserve resources in terms of costs, time, and materials
The “ZugKraftSensor” project developed a silicon-based technology platform for permanently monitoring belt tension up to a load of around 35 kN in drive technology systems. By monitoring the mechanical tension, maintenance intervals can be planned precisely, material fatigue can be detected at an early stage and unplanned downtimes can be avoided
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