Packaging – CiS

Completion of the HIVOS Project: Hybrid Integrated Optical Sensors Based on Pre-structured Adhesive Layers

15. July 2026/in MOEMS, Packaging, Process development

The HIVOS research project investigated the interaction of various pre-structured adhesive layers in combination with high-precision joining technologies and automated assembly processes for the hybrid assembly of complex optoelectronic microsystems. Newly developed automation solutions now enable the fully automated assembly of modules at the wafer or panel level, thereby significantly reducing process times

Rapid IC Prototyping Using Advanced Bonding Technologies

10. November 2025/in Events, Packaging

The development of integrated circuits often requires multiple iterations. A rapid evaluation of the first prototypes provides insights into the functionality achieved and areas for improvement, and can significantly shorten development times. The CiS Research Institute has advanced assembly technologies and skilled experts to enable even complex test setups quickly and cost-effectively. This gives our partners a head start in developing new solutions. INOVA Semiconductors GmbH (Munich) recently took advantage of these opportunities

New assembly technologies for IR components based on polymer-free joining technologies

29. July 2025/in IR, MOEMS, Packaging

The new ZIM project IR-Batch focuses on the development of new assembly technologies for infrared components based on polymer-free joining technologies for use at high temperatures and in extreme environmental conditions. The CiS Research Institute is responsible for technology development

Development of a high-pressure sensor up to 300 MPa with front-flush media connection

23. July 2025/in MEMS, Packaging, Pressure

The ambitious goal of the research project was achieved with the successful development of a silicon-based high-pressure sensor with front-flush media contact for a measuring range up to 300 MPa. The front-flush media connection makes the sensor ideal for sensitive areas with strict hygiene regulations, such as in the food industry or pharmaceuticals

End of project PoRr: Photodiodes without back reflection

20. March 2025/in Measurement, MOEMS, Packaging

In the PoRr project, a team of scientists from the CiS Research Institute developed photodiodes with significantly reduced back reflection. Reflections are reduced by 15% by means of special surface structuring. Specially developed measuring stations make it possible to record the proportion of total reflection at different wavelengths as well as the angular distribution of the reflected light at different angles of incidence

CoGeQ project meeting at the CiS Research Institute

14. March 2025/in Events, Packaging, Quantum

On 7th March 2025, the partners of the BMBF joint project “Competitive German Quantum Computer (CoGeQ)” discussed the current project status at the CiS Research Institute in Erfurt

Project start SiCher – SiC detectors for high-energy radiation

15. May 2024/in MOEMS, Packaging, UV

The aim of the recently launched SiCher research project is to develop industry-oriented functional models of SiC detectors for measuring high-energy radiation, in particular UV and X-ray photons as well as electrons. The focus of the development work is not only on the detectors themselves, but also on the assembly and connection technology

CiS Research Institute at IVAM Hightech Summit in Frankfurt

6. May 2024/in Events, Packaging, Photonic

Packaging technology for thermal flow sensors

12. April 2024/in Medical technology, MEMS, Packaging

The newly launched Pack-Flu project deals with the design, realization and characterization of a robust and innovative packaging platform for low-cost MEMS-based microcalorimetric flow sensors for use in gas pipelines or ventilation systems. The platform serves as a scalable basis for flow sensors for analyzing and controlling air flow, hydrogen and other non-aggressive gases with known flow direction (e.g. in pipelines) with high accuracy

Evaluation of quantum materials in industrial pressure sensors

27. February 2024/in Events, Packaging, Pressure

At the CiS Research Institute, pressure sensors based on NV centers in diamond were produced using industrial manufacturing methods in cooperation with partners from industry and science. The results of the Qind research project will be presented at the 28th Hasselt Diamond Workshop SBDD