Based on a MEMS technology platform, a sensor module was developed that determines the preload force and the operating force as well as their change over time. The user can flexibly design a measurement cycle, thus achieving greater maintenance intervals as well as the possibility of remote diagnostics
Our second online webinar on the topic of “Silicon-based Piezoresistive Force Sensors” on 20.04.2021 was a complete success. The speakers Dr. Klaus Ettrich, Business Unit Manager MEMS, Dr. Thomas Frank, Department Manager MEMS, and André Grün, Development Engineer Packaging Technology, presented MEMS-based piezoresistive force sensors for monitoring preload forces or contact forces
The 1st status workshop of the BMBF growth core HIPS will take place on April 7, 2021 as a free online event. Organized by the host TU Ilmenau, guests and interested parties are welcome from 9:00 to 16:30. The CiS Research Institute is involved in two projects to develop an innovative multi-sensor platform for capturing sensor information in challenging environments
The CiS Research Institute uses its competences in packaging and interconnection technology for the further development of the founding project of Ilmsens GmbH. Processes such as chip-to-chip contacts with extremely short and flat loops as well as long-term stable, hermetic packaging drive the miniaturization of the “system-in-package” sensor
MEMS-based piezoresistive force sensors can be used to monitor preload forces or contact forces. Our webinar will go into the technical basics of such sensors and we will show you some demonstrators of silicon strain gauges (Si strain gauges) developed by us
The market for thermopile sensors is growing and will continue to gain from the current COVID pandemic. In the current project NIVo two established principles are combined to a novel isothermal sensor by front cavities and thus the innovation capability in this field is further developed
After a successful pitch in yesterday’s technology competition getstarted2gether, Hans-Christian Fritsch, Managing Director of Ilmsens GmbH, and Thomas Brock, Managing Director of the CiS Research Institute, today signed a letter of intent to further develop the founding project “Ultra-wideband microwave sensor technology
The CiS Research Institute uses its own piezoresistive, miniaturised silicon strain sensors (Si-DMS) with an integrated full bridge for hybrid force sensors. Glass solder bonding is used to join the Si strain gauges on the spring body at 90° to each other
CiS presents the latest developments in optics and photonics on the special exhibition area “Microtechnologies for Optical Devices” designed by the IVAM Microtechnology Association daily from 9:30 to 17:00
The InnoCON is a platform that presents successful projects and invites networking. The CiS Research Institute presented technological challenges of the project “TeSIS – Textured Blackbody MEMS IR Emitter” and presented itself at the joint stand of the FTVT
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
