In the newly started project KoSenDi (Compact Sensor Unit for the Measurement of Magnetic Fields Using Diamond Fluorescence), scientists at the CiS Research Institute are working on the miniaturization of a magnetic field sensor based on sticksoff defects (NV centers) in diamond
The “Hivos” project follows the industry’s request and aims at higher automation by deposition and patterning of adhesive coatings at wafer level and the associated improved assembly accuracy. Innovative materials and processes are also intended to increase value creation at wafer/benefit level
The first CiS Workshop 2023 was themed “Modern Analytics for Innovative and Sustainable Sensing & Materials Science” and highlighted current results from research and development in modern analytics for the semiconductor industry on June 6, 2023. Two more exciting CiS Workshops will take place in September 2023 at the CiS Research Institute in Erfurt, Germany
Under the motto “Pipelines in Climate Change”, the 37th Pipeline Technology Symposium starts today in Dortmund. Colleagues from the field of MEMS, report in their presentation on “Innovative sensor technology for flange gasket monitoring”. The conference deals with topics related to pipeline technology, valve technology, plant technology and industrial service
The newly launched research project “Stress-independent on-chip temperature sensing for silicon strain gauges (SOT)” aims at developing a temperature sensing of piezoresistive transducers optimized with respect to mechanical stress. This is to be achieved by using on-chip integrated bipolar structures
The project “Shade-free UV illumination” involved the development of a technical solution for UVC-LED-based disinfection of medical devices, specifically endoscopes. By means of innovative assembly and connection techniques, an appropriate heat management was achieved
In the smartBond project, the assembly and force-fit and electrically conductive joining of photodiodes to hybrid detector modules was investigated and optimized by means of thermocompression bonding with chemically electrodeposited pillar structures and their highly accurate positioning by means of so-called self-alignment.
The international conference CICMT starts tomorrow in Vienna. The CiS Research Institute together with VIA electronic GmbH will present current research results of the HIPS growth core with test wafers and test setups for application in industrial automation in the accompanying trade exhibition
At the first World of QUANTUM, the CiS Research Institute will present research and development priorities in the field of applied quantum technologies in three poster contributions. From 26 to 29 April 2022, the trade fair will take place parallel to LASER World of PHOTONICS at the Munich Trade Fair Center in Hall 4
At the 2nd HIPS “Silicon meets Ceramics” status workshop, the alliance partners will provide an overview of the current status of their R&D work. Tomorrow’s online event will focus on high-performance sensor technology, multilayer ceramic technology and silicon-based packaging technology
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