Barometric MEMS pressure sensor for bio- and medical technology
At Sensor+Test 2017, the CiS Research Institute for Microsensors presents highly stable, media-resistant barometric pressure sensors in MEMS technology
Mounting UV LEDs flexibly and efficiently – Fully automatic micro-assembly centre with diversity
/in MOEMS, Packaging, UVA new micro-assembly centre expands the technological basis for the development of technological solutions for the fully automated assembly of application-specific UV LED modules in different series sizes and designs, whether as single LED sources or area lamps.
The modular system concept enables the most important AVT assembly steps to be carried out in one unit
Fast and small spectral sensors for fibre Bragg gratings
/in MOEMS, PackagingThe MEMS technologies available and further developed at the CiS Research Institute were the basis for the development of a new generation of spectral sensors consisting of two detector chips stacked on top of each other. Each covers a specific spectral range. The upper diode is only 50 µm thin
Silicon strain gauge
/in Force, Measurement, Medical technology, MEMS, Packaging, PressureFor precision force measurements, the CiS Research Institute has developed miniaturised silicon strain gauges (Si-DMS) with an integrated measuring bridge. The piezoresistive resistors are monolithically integrated in single-crystal silicon (K-factor = 80) and are available as a double strain element and as a full bridge
New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue
/in Medical technology, MOEMS, PackagingCiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient
Assembly & Packaging – compact, application-specific and industry-relevant
/in MOEMS, Packaging, UVA new micro assembly center expands the technological basis for new concepts for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important AVT assembly steps to be carried out in one device
Strain gauges for demanding applications
/in Force, MEMS, PackagingFor precision force measurements, the CiS Research Institute from Erfurt has developed miniaturized silicon strain gages (Si strain gages) with integrated measuring bridge. By using semiconductor technologies, a higher long-term stability, precision and measurement reliability is achieved compared to ductile metal strain gages
Assembly & Packaging – compact, application-specific and industry relevant
/in MOEMS, Packaging, UVA new micro assembly centre expands the technological basis for the development of technological solutions for the fully automated production of application-specific UV LED modules in different series sizes. The modular system concept enables the most important packaging steps to be carried out in one unit
New sensor technologies for pulse contour analysis, determination of heart rate variability and measurement of blood flow in tissue
/in Medical technology, MOEMS, PackagingCiS Research Institute introduces miniaturized silicon integrated multispectral photoplethysmography sensors. These are placed in the external auditory canal and are individually adapted to the patient
Miniaturized silicon strain elements
/in Force, Medical technology, MEMS, PackagingFor precision force measurements in medical technology applications, the CiS Research Institute from Erfurt, Germany, has developed silicon strain gages (Si strain gages) with integrated measuring bridge. By using semiconductor technologies, a higher long-term stability, precision and measurement reliability is achieved compared to ductile metal strain gages