MEMS-based piezoresistive force sensors can be used to monitor preload forces or contact forces. Our webinar will go into the technical basics of such sensors and we will show you some demonstrators of silicon strain gauges (Si strain gauges) developed by us
The market for thermopile sensors is growing and will continue to gain from the current COVID pandemic. In the current project NIVo two established principles are combined to a novel isothermal sensor by front cavities and thus the innovation capability in this field is further developed
After a successful pitch in yesterday’s technology competition getstarted2gether, Hans-Christian Fritsch, Managing Director of Ilmsens GmbH, and Thomas Brock, Managing Director of the CiS Research Institute, today signed a letter of intent to further develop the founding project “Ultra-wideband microwave sensor technology
The CiS Research Institute uses its own piezoresistive, miniaturised silicon strain sensors (Si-DMS) with an integrated full bridge for hybrid force sensors. Glass solder bonding is used to join the Si strain gauges on the spring body at 90° to each other
CiS presents the latest developments in optics and photonics on the special exhibition area “Microtechnologies for Optical Devices” designed by the IVAM Microtechnology Association daily from 9:30 to 17:00
The InnoCON is a platform that presents successful projects and invites networking. The CiS Research Institute presented technological challenges of the project “TeSIS – Textured Blackbody MEMS IR Emitter” and presented itself at the joint stand of the FTVT
As base metallization, copper offers a wide range of metallization possibilities which are necessary for process optimization of the thermocompression process
From 28 to 30 October 2019, employees of the CiS Research Institute will present the latest development results on optical microsystems, packaging and measuring technology in three of the sessions on offer
At Sensor+Test 2019, the CiS Research Institute will present current developments and research results from the MEMS, MOEMS and silicon detectors business units for applications in industry, medical and environmental technology
At HMI 2019, CiS will be presenting sophisticated packaging for time-of-flight camera modules, double-sided microstrip detectors and other current development results in a double pack at the Thuringia joint LEG stand in Hall 4, Stand F34 and at the stand of Forschungs- und Technologieverbund Thüringen e.V. (FTVT) in Hall 2, Booth A27
Konrad-Zuse-Str. 14
99099 Erfurt
Germany
Tel.: +49 361 663 1410
E-Mail: info@cismst.de
