Pressure – CiS

InnoCON Thuringia 2021 also starts online in 2021

30. November 2021/in Events, IR, Pressure /by CiS

InnoCON, the flagship event for the implementation and further development of the Thuringian Innovation Strategy, has just started. Steffen Biermann presents the joint project “IR sources for modern gas sensors”. Together with CMOS IR GmbH, the CiS Research Institute has developed a technology for the production of miniaturized IR emitters. Dr. Klaus Ettrich is the contact person for “H2 pressure sensors”. In the consortium HYPOS the CiS Research Institute developed a hydrogen resistant MEMS based pressure sensor, which can be used as a component in a H2 multisensor system that determines not only the pressure but also the temperature, residual gases and the concentration of hydrogen

2nd Status Workshop of the BMBF Growth Core HIPS: “Silicon meets Ceramics

23. November 2021/in Events, MEMS, Packaging, Pressure /by CiS

At the 2nd HIPS “Silicon meets Ceramics” status workshop, the alliance partners will provide an overview of the current status of their R&D work. Tomorrow’s online event will focus on high-performance sensor technology, multilayer ceramic technology and silicon-based packaging technology

Development of Stacking Technologies for Resonant Silicon Differential Pressure Sensors (ReSi-DDS)

17. November 2021/in MEMS, Pressure, Waferprocessing /by CiS

Resonant pressure sensors have versatile potential for applications in the hydrogen economy. The newly launched research project ReSi-DDS of the CiS Research Institute aims at the development of stacking technologies for the fabrication of resonator structures for resonant silicon pressure sensors

AniTHA – Analog integrated temperature compensation for high temperature applications

16. August 2021/in MEMS, Pressure /by CiS

The newly designed piezoresistive pressure sensor chips with analog integrated temperature compensation are suitable for operating temperatures of up to about 300°C. The sensor is based on an intelligent connection of the measuring bridge with passive components. The basis is an intelligent interconnection of the measuring bridge with passive components

Trade Fair Sensor+Test and Congress SMSI

30. April 2021/in Events, Force, MEMS, MOEMS, Pressure /by CiS

Next week, the SENSOR+TEST 2021 trade fair and the accompanying international congress SMSI 2021 will start. Both events will take place online and the CiS Research Institute will be represented with a digital presence and a presentation. Get your free online ticket

Exhibition booth at HM21 Digital Edition

12. April 2021/in Events, Force, MEMS, MOEMS, Pressure, UV /by CiS

This week at HM21 Digital Edition, we present current research topics and project results in the development of silicon-based MEMS and MOEMS sensor concepts

H2MEMS – Novel hydrogen sensor with highest sensitivity and selectivity based on silicon-based MEMS sensor structures

12. March 2021/in Energy, MEMS, Pressure /by CiS

As a specialist in the development of silicon-based pressure sensors, the CiS Research Institute is developing and testing palladium-coated MEMS structures with its partners in the H2MEMS project. The volume expansion of palladium during hydrogen deposition is being tested as a measuring principle

Long-term stable passivation of piezoresistive sensors for demanding sensor environments

11. January 2021/in MEMS, Pressure /by CiS

Direct contact with the medium is difficult to implement for silicon-based microsensors. In order to fully exploit miniaturisation, corrosion protection is applied at chip level. This makes an application in more demanding environments possible even without additional protective constructions

Patent application for multilayer structures for chemically resistant, long-term stable differential pressure sensors

13. November 2020/in MEMS, Pressure /by CiS

Harsh environmental conditions require robust and stable pressure sensors. The new and further development of wafer-level packaging technologies increases performance, extends areas of application and reduces manufacturing costs. The result is patent pending

MEMS workshop: Wafer bonding process for pressure sensors

30. October 2020/in Events, MEMS, Pressure /by CiS

The participants of the CiS MEMS workshop on pressure sensor technology discussed online the development of sensor elements, their assembly, test methods and applications. Innovative AVT, in particular wafer bonding processes, were a focal point this time