Silicon strain gauges (Si-SG) offer numerous outstanding properties. To reduce or compensate for the effects of temperature, temperature-sensing resistors, temperature diodes, and bipolar transistors were also integrated onto the same chip. The on-chip pnp transistors made it possible to implement temperature-compensated sensor configurations
ENFORCE TAC, Germany’s leading trade fair for security and defense, will kick off in Nuremberg on 23rd February 2026. The CiS Research Institute will be represented for the first time with a stand in Hall 6, Stand 6-215, the joint stand of LEG Thüringen, showcasing relevant development results such as a mobile vital sensor system, customer-specific photodiode modules for laser warning systems, a retrofit kit for non-invasive pressure measurement, and sensors for belt tension monitoring
In the KTB project, various programs were combined into a complex simulation tool for the development of high-precision and long-term stable pressure sensors in order to simulate the characteristic curves of MEMS components, enabling a continuous simulation process
The new “ZEBA” research project is investigating image-property relationships and developing an AI-supported process flow that can be integrated into the manufacturing process and provides non-destructive information about the expected burst pressure of individual chips
COMPAMED, a leading international trade fair for medical suppliers, begins today in Düsseldorf. The CiS Research Institute will be represented at the IVAM joint booth in Hall 8a, Booth F35-2. Until Thursday, 20th November 2025, experts in the medical supply sector will come together to present components for medical devices and equipment and discuss high-tech solutions
On 12th and 13th November 2025, the 24th Precision Fair will take place at the Brabanthallen in ‘s-Hertogenbosch. The CiS Research Institute for Microsensor Technology will be exhibiting for the first time at the joint stand of LEG -Thüringen in hall 6, booth202
The ADAM research project aims to improve the properties of pressure sensors, such as chemical resistance and operating temperature, through the use of glass-ceramic components. This requires the optimization of joining techniques, which are being extensively tested
The new PaRiS research project focuses on the development of technological complexes for the production of resonator structures for resonant sensors based on polycrystalline silicon for use as pressure sensors
The ambitious goal of the research project was achieved with the successful development of a silicon-based high-pressure sensor with front-flush media contact for a measuring range up to 300 MPa. The front-flush media connection makes the sensor ideal for sensitive areas with strict hygiene regulations, such as in the food industry or pharmaceuticals
In the OTB project, scientists at the CiS Research Institute pursued the goal of reducing or optimizing cross-sensitivity for highly stable and highly accurate piezoresistive resistance bridges consisting of resistance tracks implanted in single-crystal silicon with a high temperature coefficient
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