SAVE THE DATE – In fall 2022, we offer two CiS workshops on current research trends and their implementation in customer-specific R&D projects. On October 13, 2022, the MEMS Workshop will focus on development trends in piezoresistive silicon pressure sensors. On November 9, the already third NDIR sensor technology MOEMS workshop will take place
CiS Research Institute presents highlight at Sensor+Test 2022 as part of the AMA Association’s annual press conference. At the same time, together with Micro-Hybrid Electronic, Siegert Thin Film Technologie and 5microns, we are nominated for the AMA Innovation Award 2022 with the development of a technology platform for highly reliable NDIR gas sensors
InnoCON, the flagship event for the implementation and further development of the Thuringian Innovation Strategy, has just started. Steffen Biermann presents the joint project “IR sources for modern gas sensors”. Together with CMOS IR GmbH, the CiS Research Institute has developed a technology for the production of miniaturized IR emitters. Dr. Klaus Ettrich is the contact person for “H2 pressure sensors”. In the consortium HYPOS the CiS Research Institute developed a hydrogen resistant MEMS based pressure sensor, which can be used as a component in a H2 multisensor system that determines not only the pressure but also the temperature, residual gases and the concentration of hydrogen
At the 2nd HIPS “Silicon meets Ceramics” status workshop, the alliance partners will provide an overview of the current status of their R&D work. Tomorrow’s online event will focus on high-performance sensor technology, multilayer ceramic technology and silicon-based packaging technology
Resonant pressure sensors have versatile potential for applications in the hydrogen economy. The newly launched research project ReSi-DDS of the CiS Research Institute aims at the development of stacking technologies for the fabrication of resonator structures for resonant silicon pressure sensors
The newly designed piezoresistive pressure sensor chips with analog integrated temperature compensation are suitable for operating temperatures of up to about 300°C. The sensor is based on an intelligent connection of the measuring bridge with passive components. The basis is an intelligent interconnection of the measuring bridge with passive components
Next week, the SENSOR+TEST 2021 trade fair and the accompanying international congress SMSI 2021 will start. Both events will take place online and the CiS Research Institute will be represented with a digital presence and a presentation. Get your free online ticket
This week at HM21 Digital Edition, we present current research topics and project results in the development of silicon-based MEMS and MOEMS sensor concepts
As a specialist in the development of silicon-based pressure sensors, the CiS Research Institute is developing and testing palladium-coated MEMS structures with its partners in the H2MEMS project. The volume expansion of palladium during hydrogen deposition is being tested as a measuring principle
Direct contact with the medium is difficult to implement for silicon-based microsensors. In order to fully exploit miniaturisation, corrosion protection is applied at chip level. This makes an application in more demanding environments possible even without additional protective constructions
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