Silicon-based microsensors and their applications – double pack at HMI 2019
At HMI 2019, CiS will be presenting sophisticated packaging for time-of-flight camera modules, double-sided microstrip detectors and other current development results in a double pack at the Thuringia joint LEG stand in Hall 4, Stand F34 and at the stand of Forschungs- und Technologieverbund Thüringen e.V. (FTVT) in Hall 2, Booth A27