From 9th-11th June 2026, the CiS Research Institute will once again be exhibiting at the international gathering for sensor, measurement, and testing technology in Nuremberg. At SENSOR+TEST 2026, interested visitors can meet our experts at Booth 501 in Hall 1 and discuss the latest research findings in silicon-based microsensor technology.
At the 23rd ITG/GMA Symposium “Sensors and Measurement Systems 2026,” the accompanying scientific conference at the Nuremberg Convention Center West (NCC West), the CiS Research Institute will be represented with four scientific presentations:
On 9th June 2026, Cathleen Kleinholz will present during the “Force, Torque, and Pressure” session on the integration of silicon-based strain gauges into ceramics for the realization of wet-wet differential pressure sensors.
During the poster session in the evening, Dr. Heike Wünscher will present a photoacoustic measurement system for determining the residual ammonia content in gas at the outlet of a cracker in a flow-through configuration. The new measurement platform is based on innovative thermal emitters, operates without a chopper, and was developed in the NH3-BZ research project.
Dr. Thomas Frank will give two presentations on 10th June 2026, in the “Mechanical Variables” session: first, he will explain flexible solutions for industry and infrastructure through structural monitoring using passive RFID strain sensors, and then he will present the development of a media-resistant absolute pressure sensor without oil filling and with flush media contact.
Sensor+Test is the central platform for innovative sensor and measurement technology, scientific research, technological innovations, and industrial practice. We look forward to an exciting exchange and warmly welcome you to our booth 501 in Hall 1 or during our scientific presentations in NCC West.
Our trade show highlights at Booth 501 in Hall 1:
Technology platform with minimal offset (miniOffset)
The miniOffset project successfully developed a scalable piezoresistive MEMS technology platform for high-precision yet cost-effective sensors. The platform is based on micromechanically fabricated structures with thin membranes. The goal was to reduce zero offset and its temperature dependence at the wafer and chip levels. By optimizing the structural and process parameters, offset values of ±1 mV/V were achieved. For chips with larger deviations, additional compensation structures were employed. A differential pressure sensor in the low- to medium-pressure range with sensitivities of over 2 mV/V/kPa is demonstrated.
» Infosheet Technology platform with minimal offset (miniOffset)
Low-gain avalanche detectors for 1 keV electrons (eLGAD)
Semiconductor detectors for electron beams are used in a variety of applications in research, medical technology, industry, and security technology. In particular, the measurement of low-energy electron beams (< 1 keV) poses a sensing challenge, as these beams have very shallow penetration depths into the detector material. The sensor must therefore be extremely surface-sensitive, which requires innovative technologies. The demonstrators developed in the eLGAD project are available for sampling by users and technology transfer companies.
» Infosheet Low-gain avalanche detectors for 1 keV electrons (eLGAD)
Cost-effective housing for IR emitters (KHIS)
The KHIS project developed a scalable housing platform for MEMS-based IR emitters with an SMD-compatible package on conventional FR-4 circuit board material or ceramic LTCC material. It can be customized to fit any emitter size and reduces assembly costs thanks to SMD technology and smaller, more cost-effective window and filter areas. Especially in the mid-IR range, users benefit from a more compact, cost-effective optical window/filter.
This innovative emitter design, thanks to its flip-chip construction, doubles the radiation power above 6 µm—a decisive advance for the “fingerprint analysis” of many organic gases and liquids. The package meets all requirements: hermeticity, filtering, heat dissipation, and easy integration into circuits and sensor systems.
» Infosheet Cost-effective housing for IR emitters (KHIS)
High-pressure sensor with flush-mounted media connection (DS300MPa)
For applications exceeding 70 MPa, thin-film technology on steel is primarily used. Sensors with a flush-mounted media connection can only be produced using this technology with considerable effort. A new technological development in the DS300MPa project enables a strict separation from the electrical side and allows for customer-specific adaptations.
» Infosheet High-pressure sensor with flush-mounted media connection (DS300MPa)
Hybrid integrated optical sensors based on pre-structured adhesive layers (Hivos)
The Hivos project investigated the interaction of various pre-structured adhesive layers in combination with high-precision joining technologies and automated assembly processes for the hybrid assembly of complex optoelectronic microsystems. Newly developed automation solutions now enable the fully automated assembly of modules at the wafer or panel level, thereby significantly reducing process times.
» Infosheet Hybrid integrated optical sensors based on pre-structured adhesive layers (Hivos)
Pressure sensor for ultra-high-pressure applications (DSNemo)
Traditionally, pressure sensors use a bending plate to increase sensitivity. For ultra-high-pressure applications, a bending plate is not necessary, significantly reducing the size of the assembly. The new technology platform offers many advantages, including a front plate with a diameter of 1 mm, a pressure range up to approximately 20,000 bar, a measurement span of > 20 mV/V, and a maximum operating temperature of 200 °C.
» Infosheet Pressure sensor for ultra-high-pressure applications (DSNemo)
The research and development work described above was funded by the Federal Ministry for Economic Affairs and Energy (BMWE) through the following research projects:
Technology platform with minimal offset (miniOffset), Funding code: 49MF220087
Low-gain avalanche detectors for 1 keV electrons (eLGAD), Funding code: 49MF220095
Cost-effective housing for IR emitters (KHIS), Funding code: 49MF220218
High-pressure sensor with flush-mounted media connection (DS300MPa), Funding code: 49MF220019
Hybrid integrated optical sensors based on pre-structured adhesive layers (Hivos), Funding code: 49MV220228
Pressure sensor for ultra-high-pressure applications (DS-NEMO), Funding code: 49MF220036
