Cost-efficient housing for IR emitters
| German title: | Kosteneffiziente Hausung für IR-Strahler | |
| Acronym: | KHIS | |
| Duration: | 1st May 2023 - 31st October 2025 | |
| Description: | In the KHIS project, a cost-effective package solution for small MEMS IR emitters is to be found. These packages should offer a significant advantage in processability, usability and cost compared to conventional TO-sockets. At the same time, the package solution should be applicable to different emitter sizes and have suitable thermal properties. Scalability and automated manufacturing shall be considered from the outset. The package platform should house medium-size emitter types, while being easily adaptable to the size in question, not compromising optical functionality and effectively dissipating heat loss. Housing and chip form one assembly. Specific requirements must be met, such as chip size, thermal properties, processability and usability, and it must also be more cost-effective than comparable TO sockets. |
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| Funded by: | Federal Ministry of Economic Affairs and Climate Action |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF220218 | |
| Contact: | Contact us about this project via our business unit MOEMS | |
News articles about KHIS: | ||
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Project start: Cost-efficient housing for IR emitters 1. June 2023 |
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