The international conference “Ceramic Interconnect and Ceramic Microsystems Technologies” will focus on cost-effective and reliable high-performance ceramic interconnect products for microsystems in extreme environments in the automotive, aerospace, lighting, solar and communications industries from July 13 to 15, 2022.
The international conference in Vienna will be accompanied by a trade exhibition. The growth core “HIPS – High-Performance Sensor Systems” will demonstrate current research results here and will be represented by Dr. Michael Hintz, Head of the Department of Assembly & Packaging at the CiS Research Institute, and Uwe Krieger, VIA electronic GmbH. The Thuringian alliance of research institutions and companies aims to develop and jointly market novel, robust, highly integrated sensors based on a unique combination of silicon technology (Si) and ceramic multilayer technology (Cer). Here, the CiS Research Institute focuses on its competencies in assembly & packaging technology, in particular the reliable contacting and joining of SiCer substrates. Various test wafers and test setups for industrial automation applications will be exhibited:
- Relative pressure sensor (40bar) for level measurement,
- Absolute pressure sensor (4bar) for gas sensors and level measurement,
- Test wafers of IR components with internal MoSi contact structures for gas sensors and temperature measurement as well as
- Test wafers with cavities for pressure and IR sensors.