Cu-Pillars as basis for 3D integration
As base metallization, copper offers a wide range of metallization possibilities which are necessary for process optimization of the thermocompression process
CiS at the MikroSystemTechnik Kongress in Berlin from 28-30 October 2019
/in Events, Measurement, MOEMS, Packaging, PhotonicFrom 28 to 30 October 2019, employees of the CiS Research Institute will present the latest development results on optical microsystems, packaging and measuring technology in three of the sessions on offer
Silicon-based microsensors for industry, medical and environmental technology
/in Events, Force, IR, MEMS, MOEMS, Packaging, Photonic, Pressure, Quantum, Silicon Detectors, UVAt Sensor+Test 2019, the CiS Research Institute will present current developments and research results from the MEMS, MOEMS and silicon detectors business units for applications in industry, medical and environmental technology
Silicon-based microsensors and their applications – double pack at HMI 2019
/in Events, MEMS, MOEMS, Packaging, Pressure, Silicon DetectorsAt HMI 2019, CiS will be presenting sophisticated packaging for time-of-flight camera modules, double-sided microstrip detectors and other current development results in a double pack at the Thuringia joint LEG stand in Hall 4, Stand F34 and at the stand of Forschungs- und Technologieverbund Thüringen e.V. (FTVT) in Hall 2, Booth A27
CiS at the SPIE Photonics West in San Francisco
/in Events, MOEMS, Packaging, Photonic, UVThe SPIE Photonics West in San Francisco, the world’s largest event for photonic technologies, will start on Saturday with three conferences and two trade fairs
Sensors for biomedicine presented at the 25th Innovation Day of the BMWi
/in Events, Medical technology, MEMS, Packaging, PressureOur exhibition at the Innovation Day of SMEs of the BMWi on June 7, 2018 in Berlin generated good feedback and high interest. Here, our research institute presented the INNO-KOM project “Wafer Level Packaged Pressure Sensor With Through Silicon Vias”
Workshop „Future Technologies for Radiation Detectors”
/in Analytics, Events, Packaging, Silicon DetectorsFor the 3rd time, the international workshop “Future of Silicon Detector Technologies” focused on technologies and devices for the development and production of radiation detectors. The focus was also on future research priorities in order to be able to manufacture sensors with extremely high radiation hardness with long-term stability and at low cost. In particular, the new experiments at CERN and at the Gesellschaft für Schwerionenforschung (Society for Heavy Ion Research) in Darmstadt require this radiation hardness in addition to other technical parameters
06.02.2018: CiS at SPIE Photonics West 2018
/in Events, MOEMS, Packaging, Photonic, WaferprocessingFor the first time, CiS Forschungsinstitut für Mikrosensorik GmbH was represented as an exhibitor at SPIE Photonics West 2018 in San Francisco. As one of 70 German exhibitors in the German Pavilion in the North Hall of the Moscone Center, the CiS Research Institute demonstrated its expertise in the design as well as the manufacture and assembly of customised optical microsensors
Reliable Measurement of Pressure, Force or Strain – Piezoresistive Sensor Elements in Medical Technology
/in Force, Measurement, Medical technology, MEMS, Packaging, PressurePiezoresistive pressure sensor chips from CiS are used where high precision, stability and reliability are required. The same sensor principle is now also used for force measurement in silicon strain gages. The strain-sensitive resistors are monolithically integrated into wafer-thin chips as Wheatstone measuring bridge
Microsystems technologies for medical applications
/in Analytics, Events, Medical technology, PackagingDevelopers and manufacturers of sensor technology, medical technology and bioanalytics met for the 1st workshop in Erfurt on 10 May 2017 to present innovative solutions from microsystems technology in prevention, diagnosis, analytics and therapy and to network interdisciplinarily