Assembly and interconnection technology represents a key position in microsystems technology and photonics. It includes extensive technologies and design tools for the assembly and packaging of microelectronic components in the smallest of spaces. At the workshop “Current Developments in Hybrid and Wafer-Level Assembly” on 12th September 2023 in Erfurt, experts from mechanical and plant engineering, semiconductor foundries, scientists and AVT experts discussed individual processes in assembly and interconnection technology, their current status and future potential. Mr Brock, Managing Director of the CiS Research Institute, welcomed all participants to the hybrid workshop and gave a brief overview of the value chain of the business-oriented research institute with a focus on packaging technology – the guiding principle of the workshop.
As keynote speakers, Mario von Podewils and Dr. Tino Jäger from X-FAB Semiconductor Foundries GmbH explained in their tandem lecture “Pure play foundry technologies for advanced heterogeneous system integration” the model of a foundry to profitably implement customer-specific product ideas. In addition to engineering solutions, changed conditions in the future working world must also be considered.
In his presentation “Glass frit bonding at component and wafer level technology and characterisation”, André Grün from the CiS Research Institute covered the range from the material to glass frit bonding at module and wafer level to the evaluation of individual mechanical and electrical parameters, such as zero point stability and long-term behaviour. He also presented various applications, including a pressure sensor with flush media contact (without oil); up to 1000 bar, ceramic and stainless steel membrane-based pressure sensors as well as various optical filters and IR emitters.
In her contribution “Joining technology with reactive layer systems from chip to wafer”, Dr. Indira Käpplinger, also from the CiS Research Institute, reported on results from the current research project “Optimised reactive bonding technology based on novel zirconium systems for use in microsystems technology”. In this IGF project, the focus of the work at the CiS Research Institute was on transferring the joining technology at chip level into a wafer bonding technology. Based on the additionally required structuring, further questions arose regarding the propagation speed, suitable connection structures between the individual elements as well as the introduction of the “ignition source” into the wafer bonder. Approaches to solutions were presented, including process integration for necessary stress compensation layers or thermal barriers between the reaction front and the substrate.
The final lecture was given by Prof. Knechtel, professor for “Autonomous Intelligent Sensors” at the Schmalkalden University of Applied Sciences and endowed professor of the Carl Zeiss Foundation. His summary gave an overview of complete AVT solutions at wafer level using monolithic MEMS-CMOS integration, wafer bonding and through-hole plating and took the audience on an exciting journey through applications in everyday life and industry.
The focus of the workshop was on silicon-based microsystems. All participants agreed: the workshop had many exciting contributions and also provided ample opportunity for sharing, networking and brainstorming.