Various adhesives and fillers are used in the micro-assembly of optical sensor modules—for example, when bonding or back-filling optical windows, filters, or fibers into or onto light detectors. Dispensing processes are often chosen for this purpose, in which the additive is applied to the correct location and in the correct amount for each component. This standard process is – especially for small batch sizes – prone to errors (such as air pockets, over- or under-dosing) and material variations (e.g., due to shelf life, temperature, or storage conditions), and it also requires a separate process for each sensor assembly.
The goal of the project was therefore to develop innovative assembly technologies based on pre-structured adhesive layers with improved placement accuracy and bond strength for the components. These adhesive layers can be applied and structured at the wafer or panel level, which is expected to increase the degree of automation. In addition, the amount or film thickness of the adhesive layers can be adjusted and reproduced with high precision, which can significantly reduce – or even completely eliminate – over- or under-dosing as well as the risk of inclusions and other defects.
As part of this project, various technologies (e.g., printing techniques and laminates) were evaluated, different materials were tested, and suitable processes were developed. In the process, the possibilities and limitations were identified, preferred variants were developed, and their feasibility was demonstrated on two prototypes (an opto-chip with fiber-optic coupling and a leveling sensor).
» Infosheet: Hybrid Integrated Optical Sensors Based on Pre-structured Adhesive Layers (Hivos)
The research and development work described here was funded by the Federal Ministry for Economic Affairs and Energy (BMWE) as part of the research project “Hybrid Integrated Optical Sensors Based on Pre-structured Adhesive Layers” (HIVOS).
Funding code: 49VMF220228
