VACOM receives Thuringia Innovation Award 2025 for miniaturized vacuum sensor CASSINI
VACOM wins the Thuringian Innovation Award 2025 and sets new technological standards with its new miniaturized vacuum sensor CASSINI. The scientific and technological basis for the microelectromechanical system (MEMS) was laid in joint research projects with the CiS Research Institute
Project completion KTB: Complex tools for component simulation
In the KTB project, various programs were combined into a complex simulation tool for the development of high-precision and long-term stable pressure sensors in order to simulate the characteristic curves of MEMS components, enabling a continuous simulation process
7th Silicon Science Award – Award ceremony at Waferbond 2025
Yesterday in Chemnitz, five young researchers were honored with the prestigious Silicon Science Award 2025. The award ceremony took place during the opening ceremony of Waferbond
Start of ZEBA project: Non-destructive image evaluation using AI-supported imaging to determine burst pressure
The new “ZEBA” research project is investigating image-property relationships and developing an AI-supported process flow that can be integrated into the manufacturing process and provides non-destructive information about the expected burst pressure of individual chips
Future prospects at the 4th Sensor and Application Technology Conference in Shenzhen, China
Prof. Thomas Ortlepp, Managing Director of the CiS Research Institute, was also impressed by the city of the future, which was still a fishing village 40 years ago and has since developed into a high-tech metropolis. He was invited to give the opening speech at the 4th Sensor and Application Technology Conference and, in his keynote address entitled “Innovations in industrial sensor technologies,” provided an overview of current development trends in silicon-based microsensor technology
CiS Research Institute at COMPAMED 2025
COMPAMED, a leading international trade fair for medical suppliers, begins today in Düsseldorf. The CiS Research Institute will be represented at the IVAM joint booth in Hall 8a, Booth F35-2. Until Thursday, 20th November 2025, experts in the medical supply sector will come together to present components for medical devices and equipment and discuss high-tech solutions
Rapid IC Prototyping Using Advanced Bonding Technologies
The development of integrated circuits often requires multiple iterations. A rapid evaluation of the first prototypes provides insights into the functionality achieved and areas for improvement, and can significantly shorten development times. The CiS Research Institute has advanced assembly technologies and skilled experts to enable even complex test setups quickly and cost-effectively. This gives our partners a head start in developing new solutions. INOVA Semiconductors GmbH (Munich) recently took advantage of these opportunities
Debut at the Precision Fair in the Netherlands
On 12th and 13th November 2025, the 24th Precision Fair will take place at the Brabanthallen in ‘s-Hertogenbosch. The CiS Research Institute for Microsensor Technology will be exhibiting for the first time at the joint stand of LEG -Thüringen in hall 6, booth202
Understanding quantum technologies – An introduction to the world of quantum
On 4th November 2025, the CiS Research Institute invited the public to an open dialogue in the historic ballroom of Erfurt City Hall under the motto “Understanding quantum technologies – popular rather than scientific.” Interested citizens enjoyed an informative introduction to the event with experiments and a welcome address from the city of Erfurt. Around 60 interested participants joined Prof. Thomas Ortlepp, Managing Director of the CiS Research Institute, on a journey into the quantum world and the development of quantum computers
Project launch SOS – Stray light suppression in optical sensor assemblies
The research project “SOS – Stray Light Suppression in Optical Sensor Assemblies” was launched with the aim of simulating and recording the occurrence and influence of stray light in miniaturized sensor assemblies and finding and evaluating methods for suppressing it. The figure shows a test vehicle consisting of a structured photodiode with a daylight filter and based on an assembly from a turbidity sensor
