Evaluation of quantum materials in industrial pressure sensors
/in Events, Packaging, PressureAt the CiS Research Institute, pressure sensors based on NV centers in diamond were produced using industrial manufacturing methods in cooperation with partners from industry and science. The results of the Qind research project will be presented at the 28th Hasselt Diamond Workshop SBDD
Innovative isothermal sensor with front cavities
/in IR, Medical technology, MOEMSIn the completed NIVo research project, a new thermopile sensor was developed that works on the principle of isothermal detection of infrared radiation and is exempt from the front side. This combination enables the production of a new type of high-performance sensor in the field of thermography
Member meeting OptoNet Live – The CiS Research Institute introduces itself
/in Events, MOEMSAs a long-standing member of OptoNet e.V., we are taking the opportunity to introduce ourselves to the members of the Photonics Network Thuringia at the virtual members’ meeting on Monday, 19th February 2024. Dr. Martin Schädel, Head of Business Unit MOEMS, will present the institute as a partner for production-oriented research and development of new sensor solutions and microsystems based on silicon technologies
Technology competition getstarted2gether enters its 7th round
/in EventsUntil 1st March 2024, interested, technology-oriented founders can apply online at www.gs2g.de with their innovative business idea. The successful Thuringian technology competition getstarted2gether was initiated jointly by the Thuringian Ministry of Economics, Science and Digital Society and the Thuringian Research and Technology Association (FTVT)
Successful week at SPIE.Photonics West
/in Events, MOEMS, PhotonicA successful week at SPIE.Photonics West in San Francisco came to an end yesterday. The trade fair is an international event for solutions, components and system support for the optics and photonics industry
Optical sensor systems at SPIE.Photonics West in San Francisco
/in Events, IR, MOEMSOn 30th January 2024, SPIE Photonics West will start in San Francisco, one of the international events for solutions, components and system support for the optics and photonics industry. The CiS Forschungsinstitut will once again be exhibiting at the German Pavilion in Hall F at booth 4205-05 in the Moscone Center. We will also be represented with five contributions at the accompanying conferences, which begin on 27th January 2024
NanoSense – Development of a hardness measuring head based on a novel combined force-displacement sensor
/in Automotive, Force, Medical technology, MEMSAs part of the ZIM cooperation project NanoSense, the CiS Forschungsinstitut, together with two other partners, developed a measuring head for hardness measurement for integration into universal testing machines and xy manipulators, in which the measuring distance and measuring force are in line with each other
Highly sensitive low-noise blue-violet avalanche photodiode for diagnostics
/in MOEMS, Quantum, UVA research team from the CiS Research Institute has developed highly sensitive, low-noise avalanche photodiodes for the blue-violet light range. The new component structure and the associated optimized field distribution reduce the additional noise factor. These new BVAPs with very low noise are suitable for fluorescence analysis in biological and medical diagnostics, for example
Voltage management in thin membranes for IR emitters and sensors
/in IR, Medical technology, Simulation & DesignThe project “Voltage management in thin membranes for IR emitters and sensors”, which was launched at the beginning of November 2023, is dedicated to the important technology optimization for the production and operation of infrared (IR) sensor chips. The aim of the optimizations is to increase the yield during production and to increase the service life of the components in use
Development of innovative joining technologies for the construction of highly stable pressure transmitters (EFAH)
/in MEMS, PressureIn order to improve the performance of piezoresistive pressure sensors, various joining technologies were developed in the completed EFAH research project, which focused in particular on the critical connections between the transducer core and the electrical-mechanical process connection. Glass solders showed clear advantages here