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| Event | Date | Place | Contribution | |
|---|---|---|---|---|
| 21st Trento Workshop on advanced silicon radiation detectors | 17.02.2026 - 19.02.2026 [+Cal] |
Perugia, Italia | Presentation Optimization of low gain avalanche detectors (LGAD) for sensing low energy electrons Kevin Lauer, Thomas Klein, Stephanie Reiß, Christian Möller, Thomas Ortlepp, Stefan Meyer, Wolfgang Berger |
|
| Enforce Tac | 23.02.2026 - 25.02.2026 [+Cal] |
Nuremberg, Germany | Fair booth LEG Gemeinschaftsstand - Halle 6, Stand 215 |
|
| DPG Spring Meeting of the Atomic, Molecular, Quantum Optics and Photonics Section (SAMOP) | 01.03.2026 - 06.03.2026 [+Cal] |
Mainz, Germany | Presentation Some defects in silicon-based material towards integrated silicon photonics Philipp Kellner, Bernd Hähnlein, Kevin Lauer, Christian Möller, Kai Kühnlenz, Mario Bähr, and Thomas Ortlepp |
|
| DPG Spring Meeting of the Condensed Matter Section (SKM) | 08.03.2026 - 13.03.2026 [+Cal] |
Dresden, Germany | Poster Evolution of voids in molybdenum disilicide during electromigration experiments Julia Baldauf, Dennis Mitrenga, Tim Fink, Philipp Kellner Presentation Fluorescence lifetime measurements of NV-- and NV0- color center ensembles at room temperature and 4K in HPHT-, CVD- and nanodiamond samples Kai Kühnlenz, Kevin Lauer, Philipp Kellner, Mario Bähr, Andreas T. Winzer, Thomas Ortlepp Presentation Understanding optically detected magnetic resonance (ODMR) of InSi-Sii-defects Kevin Lauer, Bernd Hähnlein, Mario Bähr, Kai Kühnlenz, Philipp Kellner, Dirk Schulze, Stefan Krischok, Alexander Rolapp, Christian Möller, Thomas Ortlep |
|
| Sensor Shenzhen | 14.04.2026 - 16.04.2026 [+Cal] |
Shenzhen, China | Fair booth |
|
| ICEP - International Conference on Electronics Packaging and Hybrid Bonding Symposium | 14.04.2026 - 18.04.2026 [+Cal] |
Hiroshima, Japan | Presentation Fabrication and Evaluation of Fully Embedded Silicon Strain Gauges in Ceramic Material for Wet-Wet Applications C. Kleinholz, T. Frank, A. Cyriax, S. Jagomast, C. Maier, M. Hintz, A. Schroeter, U. Krieger, T. Ortlepp Presentation Investigation of laser parameters for the creation of traces and contact pads on aluminum nitride ceramics F.-M. Deckert, C. Kleinholz, C. Heinze, I. Käpplinger1, T. Ortlepp Presentation Silicon-on-Ceramic: an Innovative Technology Platform C. Kleinholz, B. Müller, M. Fischer, A. Schulz, A. Cyriax, M. Hintz, T. Ortlepp, J. Müller |
|
| 5. Symposium Elektronik und Systemintegration | 15.04.2026 [+Cal] |
Landshut, Germany | Presentation MEMS-IR-Emitter: Vom digitalen Zwilling über neuartige Verbindungstechniken bis hin zu standardisierten Messprotokollen Toni Schildhauer, Andreas Winzer, Michael Hintz, Manuel Kermann, Christian Maier |
|
| ICSM-ICQMT 2026 | 19.04.2026 - 26.04.2026 [+Cal] |
Fethiye-Ölüdeniz, Turkey | Presentation Integrated digital system solution for Superconducting quantum computing based on mK-generated Single flux quantum pulse patterns for multi-Qubit control Thomas Ortlepp, Anna Reiardt, Taghrid Haddad, Matthias Schmelz, Nobuyuki Yoshikawanh |
|
| Hannover Messe | 20.04.2026 - 24.04.2026 [+Cal] |
Hannover, Germany | Fair booth LEG Gemeinschaftsstand |
|
| Quantum Photonics | 05.05.2026 - 06.05.2026 [+Cal] |
Erfurt, Germany | Fair booth |
|
| ICCC 2026 - iCampus Cottbus Conference | 05.05.2026 - 07.05.2026 [+Cal] |
Cottbus, Germany | Poster Calculated electromigration wind force in molybdenum disilicide Julia Baldauf |
|
| SENSOR+TEST | 09.06.2026 - 11.06.2026 [+Cal] |
Nuremberg, Germany | Fair booth Halle 1, Stand 501 |
|
| CiS MEMS Workshop | 29.09.2026 [+Cal] |
Erfurt, Germany | ||
| CiS MOEMS Workshop | 01.10.2026 [+Cal] |
Erfurt, Germany | ||
