Expansion of the microassembly center for the development of application-specific UV LED modules
| German title: | Ausbau des Mikromontagecenters zur Entwicklung von anwendungsspezifischen UV-LED-Modulen | |
| Acronym: | UV-MMC | |
| Duration: | 1st January 2015 - 31st December 2019 | |
| Description: | The focus of the project was on the equipment-side and technological expansion of assembly techniques for the development of innovative, application-oriented UV-LED modules, as well as on the rapid adaptation of these processes to an industrial environment with high process reliability and rapid upscaling of quantities. The possible assembly techniques include state-of-the-art processes, which are constantly adapted to the requirements of UV-LED assembly. Novel joining techniques such as thermosonic bonding, laser soldering and sintering have been used and further developed. Special attention is paid to the further miniaturization of UVLED assemblies with improved thermal management. |
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| Funded by: | BMBF |  |
| Project sponsor: | Projektträger Jülich | |
| Funding code: | 02ZZ0108 | |
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