Planarized wafer level packaging for hermetically sealed microsensors
| German title: | Planarisiertes Wafer Level Packaging für hermetisch dichte Mikrosensoren | |
| Acronym: | PlanWLP | |
| Duration: | 1st June 2016 - 30th September 2018 | |
| Description: | A hermetic packaging process at wafer level has been developed for sensor modules based on single-crystal silicon wafers, which allows and ensures the use of these sensors for applications in medical and environmental technology as well as microfluidics. Current packaging techniques are usually very complex and cost-intensive. One way to achieve a more favorable cost structure is through wafer level packaging (WLP) in combination with a new level of miniaturization as well as a significant reduction in cross-sensitivity. The focus was on developing a polymer-free system and technology concept for system integration that limits development risks and costs and conserves resources. Technologically, the focus was on the development of a caldera planarization technology for the wafer surfaces, which makes hermetically sealed, highly stable wafer direct assembly possible in the first place. To this end, the anodic bonding process was optimized and further developed with regard to minimum temperature and time stress. | |
| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF150186 | |
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