Development of a wafer-level package for UV LEDs based on multifunctional silicon and ceramic submounts
|German title:||Entwicklung eines Wafer-Level-Packages für UV-LEDs auf Basis multifunktionalen Silizium- und Keramiksubmounts|
|Duration:||1st August 2016 - 31st July 2019|
|Description:||A critical performance parameter for UV LEDs, for example, is the external quantum efficiency (EQE). It describes the emitted light power in relation to the required electrical power. Due to the further development of component technology, these values have been increased from the original EQE ≤ 5% to EQE of 8%...10%, taking thermal management into account. This has a decisive influence on the lifetime as well as the EQE of UV LEDs.
Different models were worked out to simulate and compare the thermal resistance. On this basis, a Si submount for UV LEDs was developed with excellent thermal conductivity and thus a significant increase in lifetime. A three-dimensional design of the submount also causes the UV light emitted at the chip edges to be redirected in the forward direction by using an aluminum-coated reflector.
The subproject WLP-Mount specifically focused on Si submounts and was part of the project "Mounted UV LEDs using multifunctional silicon submounts for wafer-level packaging (MountLED)" in the consortium "Advanced UV for Life". Funded by the BMBF program Zwanzig20 - Partnership for Innovation, the CiS Research Institute as consortium partner was responsible for the work field Modules and Measurement Technology. The focus here was on the development and optimization of innovative assembly technologies in the assembly and interconnection technology depending on the specific applications as well as an industry-ready and cost-effective production.
The project on which this report is based was funded by the German Federal Ministry of Education and Research under grant number 03ZZ0129A.
|Project sponsor:||Projektträger Jülich|
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