Innovative chip-to-chip connections for high-end system requirements
| German title: | Innovative Chip-to-Chip Interconnections für high-end Systemanforderungen | |
| Acronym: | I2CON | |
| Duration: | 1st March 2017 - 31st July 2019 | |
| Description: | Numerous innovations in medical technology, high-energy physics and other imaging application fields are based on highly granular large-area silicon pixel sensors, which are connected to the adapted evaluation electronics in a cost-efficient and space-saving manner. For this purpose, new techniques for space-saving multi-channel chip-to-chip interconnections have been developed. The thin detectors and ASICs are connected by Cu pillars with palladium caps. |
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| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF160100 | |
News articles about I2CON: | ||
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Cu-Pillars as basis for 3D integration 8. October 2019 |
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