High temperature sensor technology
| German title: | Hochtemperatursensorik | |
| Acronym: | HotSens | |
| Duration: | 1st May 2017 - 31st October 2019 | |
| Description: | The aim of this project was to produce temperature diodes that can be used in the high-temperature range up to a maximum of 300°C with at most a single-point calibration. In addition, the temperature can also be determined as calibration-free as possible by using appropriate algorithms. Another essential aspect is that such elements, in addition to being used as separate components, can be better integrated into a semiconductor process (MEMS) as temperature compensation. |
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| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | MF160164 | |
News articles about HotSens: | ||
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CiS Research Institute at the microTEC Südwest Cluster Conference 2022 16. May 2022 |
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HotSens – temperature diodes for the high temperature range with one-point calibration 2. March 2020 |
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Miniaturized high-temperature pressure sensor chips at the S+T 2018 21. June 2018 |
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