Mounting stress-resistant pressure sensor chips
| German title: | Montagespannungsresistente Drucksensorchips | |
| Acronym: | MoDru | |
| Duration: | 1st April 2020 - 30th September 2022 | |
| Description: | The long-term stability of piezoresistive pressure sensor chips is significantly influenced by the assembly & packaging technology. This requires complex investigations to optimize the assembly of the sensors and often leads to compromise solutions. The influence of the assembly & packaging can be significantly reduced by a targeted design of the sensors. Thus, the necessary AVT developments can be reduced and the application performance of optimized chips can be increased. | |
| Funded by: | BMWI |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF190171 | |
| Contact: | Contact us about this project via our business unit MEMS | |
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