Micro optical leveling sensor
German title: | Mikrooptischer Nivellierungssenor | |
Acronym: | Moni | |
Duration: | 1st May 2020 - 31st October 2022 | |
Description: | Based on a special novel silicon chip and a 1-to-4 grating beam splitter, a high-resolution opto-electronic leveling sensor is developed. This is suitable to replace bubble vials, which are needed for the leveling of devices. The measurement is performed by a differential method and is possible for two tilt axes simultaneously. The accuracy of the sensor should be in the range of 20 arc seconds. | |
Funded by: | BMWI | ![]() |
Project sponsor: | Euronorm | |
Funding code: | MF200007 | |
Contact: | Contact us about this project via our business unit MOEMS |
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