Micro optical leveling sensor
| German title: | Mikrooptischer Nivellierungssenor | |
| Acronym: | Moni | |
| Duration: | 1st May 2020 - 31st October 2022 | |
| Description: | Based on a special novel silicon chip and a 1-to-4 grating beam splitter, a high-resolution opto-electronic leveling sensor is developed. This is suitable to replace bubble vials, which are needed for the leveling of devices. The measurement is performed by a differential method and is possible for two tilt axes simultaneously. The accuracy of the sensor should be in the range of 20 arc seconds. | |
| Funded by: | BMWI |  |
| Project sponsor: | Euronorm | |
| Funding code: | MF200007 | |
| Contact: | Contact us about this project via our business unit MOEMS | |
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