Development of a high-accuracy, form-fit-assisted flip-chip thermocompression process
| German title: | Entwicklung eines hochgenauen, formschluss-unterstützten Flip-Chip-Thermokompressionsverfahrens | |
| Acronym: | smartbond | |
| Duration: | 1st October 2019 - 31st March 2022 | |
| Description: | Trapping pits in the silicon are intended to improve the highly accurate positioning of the pillar structures by means of a so-called self-alignment. Due to the form closure instead of a material closure, the joining connection is to exhibit improved reliability. This process optimization will be used for two demonstrators to enable novel miniaturized hybrid assemblies of optical detector modules. | |
| Funded by: | BMWI |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF190065 | |
News articles about smartbond: | ||
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Project smartBond: Development of a high-precision, form-fit-supported flip-chip thermo-compression method 24. November 2022 |
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