Innovative packaging technology for MEMS-based thermal flow sensors
| German title: | Innovative Packaging-Technologie für thermische Fluss-Sensoren auf MEMS-Basis | |
| Acronym: | PackFLu | |
| Duration: | 1st April 2024 - 30th September 2026 | |
| Description: | The project deals with the design, implementation, and characterization of a robust and innovative packaging platform for cost-effective MEMS-based microcalorimetric flow sensors for use in gas pipelines or ventilation systems. The platform serves as a scalable basis for flow sensors for the analysis and control of air flow, hydrogen, and non-aggressive gases with a known flow direction (e.g., in pipelines) with high accuracy. | |
| Funded by: | BMWK |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF230039 | |
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