Development and testing of cleaning processes/protective coatings and determination of the wafer bondability of laser-drilled backplane wafers
| German title: | Entwicklung und Test von Reinigungsverfahren/Schutzschichten sowie Bestimmung der Waferbondfähigkeit von lasergebohrten Rückplattenwafern | |
| Acronym: | PräzDrill | |
| Duration: | 1st July 2025 - 31st December 2027 | |
| Description: | Subproject of the joint project "Technology development for the production of laser-assisted precision drilling in silicon backside wafers" High-precision silicon-based pressure sensors for process measurement technology, medical technology, energy technology, and automation technology are manufactured on Si wafers containing the corresponding pressure sensor chips. These are joined to back wafers as counter bodies. Drilled back wafers with one through-hole per chip are used for differential and relative pressure sensors. The aim of this project is to develop an innovative manufacturing technology for drilled silicon backside wafers that can be joined to pressure sensor wafers as counter bodies without any further intermediate steps. The starting material for this is thick, unstructured, and single-sided polished silicon wafers. Once the project goals have been achieved, the following advantages over current manufacturing technology will be available: undamaged wafer surfaces and minimal particle load ensure wafer bondability. The positional accuracy and dimensional stability of the drill holes ensure the functionality of the sensor chips. Cleaning steps at the semiconductor manufacturer can be eliminated. |
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| Funded by: | Federal Ministry for Economic Affairs & Energy |  |
| Project sponsor: | AIF | |
| Funding code: | KK5085712WO4 | |
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