SOI-Based Bridge-Shaped Infrared Emitter
| German title: | Brückenförmiger Infrarot-Emitter auf SOI-Basis | |
| Acronym: | BRIE | |
| Duration: | 1st July 2026 - 31st December 2028 | |
| Description: | The project is developing a new technology for manufacturing MEMS infrared emitters based on silicon-on-insulator (SOI) wafers. The resulting thin silicon membrane is highly doped to serve as an efficient IR radiation source. The membrane is partially separated from the chip frame, resulting in a bridge-shaped heater membrane with improved thermal insulation and significantly optimized emitter properties. | |
| Funded by: | Federal Ministry for Economic Affairs & Energy |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF250155 | |
| Contact: | Contact us about this project via our business unit MOEMS | |
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