Aluminum Ultra-Low-Temperature Interconnects for Radiation Detectors
| German title: | Aluminium-Ultra-Niedrigtemperatur-Interconnects für Strahlungsdetektoren | |
| Acronym: | ALUMINIS | |
| Duration: | 1st September 2026 - 31st December 2028 | |
| Description: | The aim is to develop an innovative flip-chip technology that enables the direct mounting of detector chips onto readout ASICs using aluminum as the primary contact material. This bonding process aims to eliminate the use of heavy metals and organic materials, which limit the performance and reliability of modern radiation detectors. | |
| Funded by: | Federal Ministry for Economic Affairs & Energy |  |
| Project sponsor: | Euronorm | |
| Funding code: | 49MF260050 | |
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