Fiber-Chip-Package
| German title: | Fiber-Chip-Package | |
| Acronym: | FCP | |
| Duration: | 1st August 2017 - 31st January 2020 | |
| Description: | Thanks to a novel stack design, it is now possible to perform the alignment of a superconducting chip to an optical fiber at room temperature. The positioning accuracy achieved is maintained even at low temperatures, the working range of the superconducting detectors. | |
| Funded by: | BMWI |  |
| Project sponsor: | EuroNorm GmbH | |
| Funding code: | 49MF170018 | |
| Contact: | Contact us about this project via our business unit MOEMS | |
News articles about FCP: | ||
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Recording of our latest MOEMS webinar is available [video] 23. July 2021 |
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