Stress-independent on-chip temperature detection
|German title:||Stressunabhängige on-chip Temperaturerfassung|
|Duration:||1st February 2023 - 1st July 2025|
|Description:||The aim of this project for silicon strain gauges is to develop and significantly improve temperature measurement of piezoresistive transducers by means of bipolar structures directly on the sensor chip, optimized with respect to mechanical stress.
The cross-sensitivities, especially piezojunction effects, of different bipolar components are to be investigated with respect to their technology and layout dependence.
The predictability of the temperature dependence in the entire operating temperature range is to be improved quantitatively and qualitatively.
|Funded by:||Federal Ministry of Economic Affairs and Climate Action|
|Contact:||Contact us about this project via our business unit MEMS|
News articles about SOT:
|Stress-independent temperature measurement in the new SOT project
8. February 2023
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