Miniaturized InfraRed Emitter Chip
|German title:||Miniaturisierter InfraRot-Emitter-Chip|
|Duration:||1st April 2017 - 30th September 2019|
|Description:||The aim of the project was to develop a plasma-assisted etching process for the simultaneous generation of a thin functional membrane and a fracture trench for subsequent separation of the chips by breaking them out. This is applied to MEMS IR emitters, which will thus achieve areas that are more than a factor of 4 smaller and dynamics that are a factor of 2 higher compared to the state of the art. An additional backside mirror increases the optical yield.
Packaging technology were adapted to the requirements of these components and further developed.
The results show that an optimized ICP etching process can produce emitter chips with edge lengths of less than 1mm. This leads to significant miniaturization, a multiplication of the number of units per wafer and thus a reduction in costs. The miniaturization of the infrared source also showed a significant improvement in its optical and electrical properties compared to the devices available on the market.
|Project sponsor:||EuroNorm GmbH|
News articles about MIREC:
|Innovative sensor technology for concentration measurement of gases and hydrogen at Hannover Messe 2022
2. June 2022
|SPIE Photonics West 2022 in San Francisco
20. January 2022
|InnoCON Thuringia 2021 also starts online in 2021
30. November 2021
|Successful R&D project MIREC at the BMWI 2021 Innovation Day for SMEs
14. June 2021
|Mid-Week Coffee Break – A Virtual Technology Conversation
12. May 2021
|New process for manufacturing miniaturized infrared emitter chips (MIREC)
10. July 2020
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