Project: Intelligent Development Environment for Flexible System Package Prototyping
Project No.: 2017 WIN 0001
The urge for greater complexity, further miniaturization and increased reliability under the demand for simplified assembly of complete systems calls for new solutions for system integration. Under this premise, an application was submitted to the Thüringer Aufbaubank last year for a grant in accordance with the directive of the Free State of Thuringia for the promotion of research, technology and innovation (FIT).
The investments under the project “Intelligent development environment for flexible system package prototyping” will enable research projects in the field of system package manufacturing that have as their goal the implementation of high-performance components in a multifunctional sensor platform or the provision within the framework of combination sensor technology.
The planned investments represent essential components of the process chain for the rapid implementation of new innovative solutions of compact microsystem modules. With the grant, five essential investments could be made that will have a direct impact on the research activity at CiS:
- Microlithography Cluster from the company SÜSS MicroTec Lithography GmbH
- Park NX20 atomic force microscope from Schaefer Technologies GmbH
- IR camera from the company FLIR Systems Trading Belgium BVBA
- Four-tip measuring station from the company Polytec GmbH and
- a database tool to ensure comprehensive integration of all process parameters into one database
The investments made complement important technology areas and allow a timely and flexible integration in the system prototyping environment. At the same time, the resource and cost savings will lower the acceptance threshold of Thuringian SMEs from the field of microsystem package manufacturing.