Infrared-active components in MOEMS-based sensor assemblies, e.g., for gas sensing or contactless temperature measurement systems, are becoming increasingly important. Current assembly technologies are reaching their technical limits when it comes to developing even more efficient IR components and for use under difficult conditions. The motivation for launching the new ZIM project “IR-Batch” is therefore the development of assembly technologies for IR-active semiconductor components using polymer-free joining technologies consisting of semiconductor components (IR emitters/receivers), ceramic packages, and preferably hermetically sealed encapsulation with optical windows and special gas filling. The aim is to achieve a reliable solution even for high operating temperatures, vacuum conditions, and harsh media applications. Especially for vacuum technologies, all joining materials must be polymer-free or outgassing-free—this includes die bonding, the joining of filter elements/optical windows, and encapsulation.
As part of the project, a special thermal prototype plant and the specific assembly technologies and processes will be developed and evaluated on various demonstrators.
The CiS Research Institute is responsible for technology development.
