Starting tomorrow, the CiS Research Institute will present its portfolio for the first time at EPHJ, an international trade fair for high precision in Geneva. Until 6th June 2025, we will be presenting our silicon-based sensor technologies and expertise in the field of MEMS and MOEMS to an international audience of experts at booth J122 in the Palexpo halls in Geneva.
We develop customer-specific MEMS sensor elements for mechanical and optical variables through monolithic integration of sensor functions. Our expertise lies in double-sided and three-dimensional microstructuring as well as the deposition of functional layers on silicon.
Among other things, the CiS Research Institute will be presenting a tactile sensor that can detect deviations of up to two nanometers, is based on a piezoresistive measuring bridge made of silicon, and can use different scanning tips depending on the application. The sensor is robust and has high signal stability, and is insensitive to various media in the tool room. The sensor closes a gap between AFM and a classic scanning probe device.
This trade fair is the world’s largest and most important platform for high-precision technologies and attracts numerous trade visitors from the fields of watchmaking, jewelry, microtechnology, and medical technology every year. This year, almost 700 exhibitors, including around 100 new exhibitors, will use this platform to network, gain new inspiration, and discuss current trends and challenges.
