Measurement data acquisition is playing an increasingly important role in equipment and plant engineering. Pressure sensor technology is particularly noteworthy in this context, as it can be used to determine numerous other parameters such as flow rate, fill level, weight, or force.
Pressure sensors are usually manufactured using MEMS technology as piezoresistive pressure sensors (transducer plus back plate). For cost reasons, but especially to increase functionality, the silicon backplate is to be replaced by a ceramic backplate in this project.
The aim is to improve the joining technology through glass-based wafer-level joining and the use of a joining adapter on the wafer composite to improve signal stability, insulation strength, and mountability. For additional functionalities (soldering interface, rewiring), the replacement of the SDB backplate with a ceramic backplate is planned. In a final step, the establishment of a functional front plate with fluidic and electrical interfaces (front-mountable, media-resistant) will be tested.
The research and development work described was funded by the German Federal Ministry for Economic Affairs and Energy (BMWE) as part of the research project “Development of Si pressure transducers with glass-ceramic components” (ADAM).
Fundin code: 49MF240127
