The ambitious goal of the research project was achieved with the successful development of a silicon-based high-pressure sensor for a measuring range up to 300 MPa and flush media contact.
The media-contacting components on the front side are made of robust stainless steel and are therefore particularly resistant for use in extreme environments. To ensure high measurement accuracy, the electrical side was strictly separated from the media-contacting elements.
An innovative technology was developed as part of the project: First, the Si-DMS was joined as a signal converter by means of glass frit bonding on the side of a pressure-loaded bending plate facing away from the medium. This process enabled excellent results in terms of stability and temperature behavior – up to temperatures of 200 °C. After the Si-DMS was electrically connected, the bending plate was applied to the sensor body using laser welding.
Modified designs that integrate measuring resistors insensitive to transverse strain and additional adjustments made it possible to almost completely eliminate the temperature dependence of the zero point. The technology developed is characterized by its overall efficiency and cost-effectiveness.
The newly developed sensor opens up a wide range of application possibilities for dynamic pressure measurements. Particularly advantageous is the front-flush media contact—free of excessive geometric complexities and undercuts—which makes it ideal for sensitive areas with strict hygiene regulations, such as in the food industry or pharmaceuticals.
The research and development work described was funded by the German Federal Ministry for Economic Affairs and Energy (BMWE) as part of the research project “High-pressure sensor with flush media connection” (DS300MPa).
Funding code: 49MF22001