At the end of our 3-part hybrid workshop series, the topic of “Modelling in Microsystems Technology” was intensively examined on 26th September 2023. Representatives from science and industry discussed methods, software and the use of artificial intelligence for the simulation and design of silicon MEMS and MOEMS
Next week, on 26th September 2023, the CiS workshop “Modelling in Microsystems Engineering” will take place in Erfurt as a hybrid event. In microsystems technology, reliable simulation tools are a prerequisite for supporting the design of components and systems. The workshop will discuss mechanical and optical simulations as well as multidomain modelling, with a focus on silicon MEMS and MOEMS
At the workshop “Current developments in hybrid and wafer-level assembly” on 12th September 2023 in Erfurt, experts from mechanical and plant engineering, semiconductor foundries, scientists and AVT experts discussed individual processes in packaging and interconnection technology, their technical status and future potential with a focus on silicon-based microsystems. All participants agreed: the workshop offered numerous, exciting contributions as well as opportunities for exchange, networking and idea generation
A total of five outstanding works by young researchers were honored yesterday with the Silicon Science Award. The award ceremony took place on 4th September 2023, as part of the opening event of the international 60th Ilmenau Scientific Colloquium “Engineering for a Changing World” in the Audimax of the Ilmenau University of Technology
The CiS Workshop with focus on packaging and interconnect technology will take place on 12th September 2023 in Erfurt under the motto “Current developments in hybrid and wafer-level assembly”. Look forward to exciting contributions as well as ample opportunity for professional exchange and networking
In the SiDMeses research project, the long-term stability of hybrid silicon strain sensors was significantly improved by a targeted and accelerated reduction of the mechanical assembly stress and a precise, extremely parallel and symmetrical structure was generated
The new project “Thermopiles with carbon nanotube absorbers” investigates the integration of thin coatings of carbon nanotubes on thermopiles with the aim of enabling higher absorption at low cost
In the newly started project KoSenDi (Compact Sensor Unit for the Measurement of Magnetic Fields Using Diamond Fluorescence), scientists at the CiS Research Institute are working on the miniaturization of a magnetic field sensor based on sticksoff defects (NV centers) in diamond
The new research project NivLer at the CiS Research Institute addresses the development of a retrofit kit for non-invasive pressure measurement in process pipes in order to be able to non-destructively record and digitize various condition variables
The CiS Research Institute is partner of the started joint project “DiaTip”. Together with the partners, the efficient production of diamond tips as well as a suitable assembly process for the joining of two components “active microcantilever” and “diamond tip” shall be developed
