Dr. Heike Wünscher will report on “Energy storage by water electrolysis” at the technology conference elmug4future tomorrow in Friedrichroda. In addition, the CiS Research Institute is in charge of the booth of the growth core HIPS (High Performance Sensors) in the accompanying exhibition
As part of the celebratory event for the 30th anniversary of the Aeroclub Arnstadt e.V. in the hangar of the Alkersleben airfield, Dr. Martin Schädel, Business Unit Manager MOEMS at the CiS Research Institute, gave a guest lecture on the topic of “Detection of important vital parameters with light sensor in the ear”
On 15.09. the CiS Research Institute presents its competences for a networked and intelligent infrastructure at the accompanying fair to the Thuringian Forum Mobility on the campus of the TU Ilmenau. Silicon-based sensors for hydrogen concentration measurement, sensors for CO2 measurement in breathing gas and indoor spaces or even special light incidence sensors will be shown at booth A8
In the kick-off event on 06.09.2022 for the new digital series “Spotlights of Micro- and Nanotechnology”, initiated by the IVAM Association for Microtechnology, Dr. Martin Schädel, Business Unit Manager MOEMS at the CiS Research Institute, will present, among others, the topic “Silicon Sensors for Optical Process Monitoring”
In her congress contribution at ACHEMA, Dr. Heike Wünscher from the MEMS department at the Cis Research Institute, presents research results for the passivation of silicon-based MEMS sensors and their use as flow sensors in harsh environments
For infrared emitters with blackbody properties, the CiS Research Institute developed a simplified manufacturing process. It produces a performance-enhancing micro-texture. The patent PCT/EP2018/083263 has been granted for this
In the newly opened research project, IR emitter arrays are developed, which are characterized by high dynamics and simultaneously large beam strength
The focus of the new research project is the development of a technology for sensors with flush media connection and strict separation to the electrical side for applications in the high-pressure range up to 300 MPa
